EN 1977 Grade Cu-HCP H040

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Description

Cu-DHP, mat. No CW021A, is a deoxidized copper with low phosphorus-content. To the comparable DIN-mark SF-Cu, mat. No 2.0070 acc. to DIN 1787: 1973-01 (precondition for the comparability: Cu-content min. 99,95%, deoxidation agent phosphorus) applies: The material is also available in a special quality free of steam stripping elements. This is very important for vacuum technology. Tensile strength and Brinell hardness are increasable by cold forming. SE-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: good Application: Preferably application in electrical engineering, electronics. For production of all types of semifinished parts when high electrical conductivity is demanded as well as in vacuum technology and as cladding material.

Related Standards

Equivalent Materials

Diese Materialdaten wurden von WIAM zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
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Eigenschaften

Allgemein

PropertyTemperatureValue

Dichte

20.0 °C

8.9 - 8.94 g/cm³

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Mechanisch

PropertyTemperatureValueComment

Elastizitätsmodul

20.0 °C

127 - 129 GPa

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Härte, Brinell

20.0 °C

40 [-]

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Härte, Vickers

20.0 °C

40 - 65 [-]

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Poissonzahl

20.0 °C

0.34 [-]

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Schubmodule

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Streckgrenze Rp 0,2

20.0 °C

50 MPa

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Zugfestigkeit

20.0 °C

200 MPa

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Thermisch

PropertyTemperatureValueComment

Koeffizient der thermischen Ausdehnung

100.0 °C

1.69E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.76E-5 1/K

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Schmelzpunkt

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Spezifische Wärmekapazität

20.0 °C

385 - 390 J/(kg·K)

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100.0 °C

393 J/(kg·K)

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200.0 °C

403 J/(kg·K)

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Wärmeleitfähigkeit

20.0 °C

385 - 386 W/(m·K)

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Elektrisch

PropertyTemperatureValue

Elektrische Leitfähigkeit

20.0 °C

5.70E+7 S/m

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Specific Electrical conductivity

98 % IACS

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spezifischer Widerstand

20.0 °C

1.8E-8 Ω·m

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Chemical properties

PropertyValue

Bismut

5E-4 %

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Blei

5E-3 %

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Kupfer

99.95 %

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Phosphor

2E-3 - 7E-3 %

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