LNP™ STAT-LOY™ Compound 63000CT

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Description

A permanent antistatic PC-Alloy compound that features transparency and superior cleanliness for advanced semiconductor packaging applications

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.16 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.7 %

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ISO 62 | (23°C / 50% RH)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

50 MPa

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ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Biegemodul

23.0 °C

1.1 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

140 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

1.2 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

580 J/m

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ASTM D 256 | notched, 23°C

Schlagfestigkeit, Charpy gekerbt

23.0 °C

69 kJ/m²

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ISO 179/2C | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

580 kJ/m²

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ASTM D 256 | notched, 23°C

Zugfestigkeit

23.0 °C

34 MPa

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ISO 527 | yield, 5 mm/min

Thermisch

PropertyValueComment

Heat deflection temperature, 0.45 MPa

83 °C

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ASTM D 648 | 6.4 mm, unannealed

Heat deflection temperature, 1.80 MPa

68 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Wärmeformbeständigkeitstemperatur

68 - 83 °C

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Elektrisch

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+11 - 5.00E+12 Ω

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ASTM D 257

Volume resistivity

23.0 °C

1.00E+11 - 5.00E+12 Ω·cm

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ASTM D 257

Optisch

PropertyValueComment

Opazität

10 %

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ASTM D 1003 | 2.54 mm

Transmission

81 %

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ASTM D 1003 | 2.54 mm

Rheological Properties

PropertyTemperatureValueComment

Schmelzmassenflussrate

16 g/10min

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ASTM D 1238 | 260°C/2.16 kgf

Schrumpfung

23.0 °C

0.6 %

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SABIC method

Schrumpfung, diagonal

23.0 °C

0.6 %

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SABIC method

Technological properties

Property
Application areas

Personal Computing, Semiconductor, Data Management, Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 90 to 95.0°C
Drying Time: 6 to 8.0hrs
Melt Temperature: 230 to 250.0°C
Nozzle Temperature: 230 to 250.0°C
Front - Zone 3 Temperature: 230 to 250.0°C
Middle - Zone 2 Temperature: 225 to 240.0°C
Rear - Zone 1 Temperature: 220 to 230.0°C
Mold Temperature: 40 to 50.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.