ULTEM™ Resin 1000P200 - Europe

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Description

ULTEM™ 1000P200 powder is a RoHS compliant polyetherimide (PEI) powder offering a glass transition temperature (Tg) of 217ºC. This powder has an irregular shape with an average particle size (D50) of 200 micron and a maximum particle size (D100) of 450 micron.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.27 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.7 %

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ISO 62 | (23°C / 50% RH)

Sauerstoffindex

23.0 °C

47 %

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Wasserabsorption

23.0 °C

1.25 %

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ISO 62-1 | (23°C/saturated)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

160 MPa

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ISO 178 | yield, 2 mm/min

Biegemodul

23.0 °C

3.3 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

6 %

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ISO 527 | yield, 50 mm/min

Elastizitätsmodul

23.0 °C

3.2 GPa

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ISO 527 | 1 mm/min

Hardness, Ball Indentation

23.0 °C

140 MPa

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ISO 2039-1 | H358/30

Härte, Rockwell M

23.0 °C

109 [-]

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ASTM D 785 |

Schlagzähigkeit, Izod gekerbt

23.0 °C

6 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Taber Abrasion

23.0 °C

10 mg/1000cy

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ASTM D 1044 | CS-17, 1 kg

Zugfestigkeit

23.0 °C

105 MPa

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ISO 527 | yield, 50 mm/min

Schlagzähigkeit, Izod ungekerbt

ISO 180/1U | unnotched 80*10*4, 23°C

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 0.45 MPa

200 °C

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ISO 75/Be | Edgew 120*10*4 sp=100mm

Heat deflection temperature, 1.80 MPa

190 °C

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ISO 75/Ae | Edgew 120*10*4 sp=100mm

Koeffizient der thermischen Ausdehnung

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Vicat-Erweichungstemperatur

211 °C

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ISO 306 | Rate B/50

Wärmeformbeständigkeitstemperatur

190 - 200 °C

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Wärmeleitfähigkeit

23.0 °C

0.24 W/(m·K)

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ISO 8302

thermischer Ausdehnungskoeffizient, transversal

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Elektrisch

PropertyTemperatureValueComment

Dielectric constant, 60Hz

23.0 °C

2.9 [-]

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IEC 60250 | 50/60 Hz

Dielektrizitätskonstante, 1 MHz

23.0 °C

2.9 [-]

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IEC 60250

Dissipation factor, 1MHz

23.0 °C

6E-3 [-]

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IEC 60250

Dissipation factor, 50Hz

23.0 °C

5E-4 [-]

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IEC 60250 | 50/60 Hz

Durchschlagfestigkeit

23.0 °C

16 kV/mm

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IEC 60243-1 | in oil, 3.2 mm,

Verlustfaktor

23.0 °C

2.5E-3 [-]

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IEC 60250 | 2450 MHz

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 60093

Rheological Properties

PropertyTemperatureValueComment

Schmelzvolumenflussrate

13 cm³/10min

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ISO 1133 | MVR at 360°C/5.0 kg

Schrumpfung

23.0 °C

0.5 %

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SABIC method | on tensile bar

Technological properties

Property
Application areas

Composite, Circuit Board, Adhesives, Coating

Availability

Europe

Processing methods

Drying Temperature: 150°C
Drying Time: 4 to 6.0hrs
Drying Time (Cumulative): 24hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 350 to 400.0°C
Nozzle Temperature: 345 to 400.0°C
Front - Zone 3 Temperature: 345 to 400.0°C
Middle - Zone 2 Temperature: 340 to 400.0°C
Rear - Zone 1 Temperature: 330 to 400.0°C
Mold Temperature: 135 to 165.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.