LNP™ KONDUIT™ Compound PX11311 - Asia

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Description

LNP KONDUIT PX11311 is a compound based on PA6 resin containing mineral and glass fiber. Added features include thermally conductive, electrically insulative and non-brominated, non-chlorinated FR.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Anwendungen

Elektrotechnik

Elektronik

Anzeigegeräte

Bau

Beleuchtung

Materialien von diesem Anbieter

LNP™ THERMOCOMP™ Compound WF006H

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LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.74 g/cm³ Show Supplier Material materials with Dichte of 1.74 g/cm³	ASTM D 792

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	76 MPa Show Supplier Material materials with Biegefestigkeit of 76 MPa	ASTM D 790 \| brk, 1.3 mm/min, 50 mm span
Biegemodul	23.0 °C	9 GPa Show Supplier Material materials with Biegemodul of 9 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Dehnung	23.0 °C	2 % Show Supplier Material materials with Dehnung of 2 %	ASTM D 638 \| brk, Type I, 5 mm/min
Elastizitätsmodul	23.0 °C	7.2 GPa Show Supplier Material materials with Elastizitätsmodul of 7.2 GPa	ASTM D 638 \| 5 mm/min
Schlagzähigkeit, Izod gekerbt	23.0 °C	43 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 43 kJ/m²	ASTM D 256 \| notched, 23°C
Zugfestigkeit	23.0 °C	52 MPa Show Supplier Material materials with Zugfestigkeit of 52 MPa	ASTM D 638 \| brk, Type I, 5 mm/min

Thermisch

Property	Temperature	Value	Comment
Heat deflection temperature, 1.80 MPa		199 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 199 °C	ASTM D 648 \| 6.4 mm, unannealed
Koeffizient der thermischen Ausdehnung	23.0 °C	1.94E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 1.94E-5 1/K	ASTM E 831 \| 40°C to 120°C
Thermal conductivity, through-plane	23.0 °C	1.1 W/(m·K) Show Supplier Material materials with Thermal conductivity, through-plane of 1.1 W/(m·K)	ISO 22007-2 \| ?80*3mm discs
Wärmeformbeständigkeitstemperatur		199 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 199 °C
Wärmeleitfähigkeit	23.0 °C	1.38 W/(m·K) Show Supplier Material materials with Wärmeleitfähigkeit of 1.38 W/(m·K)	ISO 22007-2 \| ?80*3mm discs
thermischer Ausdehnungskoeffizient, transversal	23.0 °C	4.59E-5 1/K Show Supplier Material materials with thermischer Ausdehnungskoeffizient, transversal of 4.59E-5 1/K	ASTM E 831 \| -40°C to 40°C

Technological properties

Property
Application areas	Electronic Components, Wiring Devices, Wireless Communications, LED Lighting, Medical Device, Personal Computing
Availability	Asia
Processing methods	Drying Temperature: 80°C Maximum Moisture Content: 0.15 to 0.25% Drying Time: 4hrs Middle - Zone 2 Temperature: 270 to 290.0°C Screw Speed: 20 to 60.0rpm Front - Zone 3 Temperature: 270 to 290.0°C Melt Temperature: 270 to 295.0°C Back Pressure: 0.2 to 0.3MPa Rear - Zone 1 Temperature: 260 to 275.0°C Mold Temperature: 85 to 100.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.