LNP™ KONDUIT™ Compound DTK22

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Description

LNP KONDUIT DTK22 is a compound based on Polycarbonate resin containing mineral. Added features include thermally conductive and electrically insulative.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.46 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.03 %

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ISO 62 | (23°C / 50% RH)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

81 MPa

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ISO 178 | break, 2 mm/min

Biegemodul

23.0 °C

4.2 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

4.1 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

3.9 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

150 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

700 J/m

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ASTM D 4812 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

13 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

41 kJ/m²

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ISO 180/1U | unnotched 80*10*4

Zugfestigkeit

23.0 °C

42 MPa

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ISO 527 | break, 5 mm/min

Thermisch

PropertyTemperatureValueComment

Glow Wire Ignition Temperature

850 °C

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IEC 60695-2-13 | 0.8 mm

Heat deflection temperature, 0.45 MPa

128 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

119 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

5.3E-5 1/K

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ASTM E 831 | 40°C to 120°C

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Thermal conductivity, through-plane

23.0 °C

0.3 W/(m·K)

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ISO 22007-2 | 60*60*3mm plaque

Wärmeformbeständigkeitstemperatur

119 - 128 °C

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Wärmeleitfähigkeit

23.0 °C

1.3 W/(m·K)

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ISO 22007-2 | 60*60*3mm plaque

thermischer Ausdehnungskoeffizient, transversal

23.0 °C

8.5E-5 1/K

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ASTM E 831 | 40°C to 120°C

Entflammbarkeit

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102451424- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.5mm UL 94 <br> Glow Wire Flammability Index, 0.8 mm: 850°C IEC 60695-2-12 <br> Glow Wire Flammability Index, 1.0 mm: 875°C IEC 60695-2-12 <br> Glow Wire Ignitability Temperature, 1.0 mm: 850°C IEC 60695-2-13

Elektrisch

PropertyTemperatureValueComment

Dielectric constant, 1GHz

23.0 °C

3.66 [-]

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ASTM ES 7-83 | 1.1 GHz

Dissipation factor, 1GHz

23.0 °C

9.4E-3 [-]

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ASTM ES 7-83 |

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.41 %

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ASTM D 955 | 24 hrs

Schrumpfung, diagonal

23.0 °C

0.39 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Wearables, Wireless Communications, Photo/Video Camera

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 2 to 4.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 260 to 300.0°C
Nozzle Temperature: 260 to 290.0°C
Front - Zone 3 Temperature: 260 to 290.0°C
Middle - Zone 2 Temperature: 260 to 290.0°C
Rear - Zone 1 Temperature: 250 to 280.0°C
Hopper Temperature: 60 to 80.0°C
Mold Temperature: 80 to 120.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.