Allgemein
Mechanisch
Property | Temperature | Value | Comment |
---|---|---|---|
Biegefestigkeit | 23.0 °C | 143 MPa Show Supplier Material materials with Biegefestigkeit of 143 MPa | ASTM D 790 |
Biegemodul | 23.0 °C | 5.6 GPa Show Supplier Material materials with Biegemodul of 5.6 GPa | ASTM D 790 |
Dehnung | 23.0 °C | 8 % Show Supplier Material materials with Dehnung of 8 % | SABIC - Japan Method | break |
Hardness, Rockwell R | 23.0 °C | 127 [-] Show Supplier Material materials with Hardness, Rockwell R of 127 [-] | ASTM D 785 |
Impact strength, Izod notched, ASTM | 23.0 °C | 87 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 87 J/m | ASTM D 256 | notched, 23°C |
Schlagzähigkeit, Izod gekerbt | 23.0 °C | 87 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 87 kJ/m² | ASTM D 256 | notched, 23°C |
Zugfestigkeit | 23.0 °C | 107 MPa Show Supplier Material materials with Zugfestigkeit of 107 MPa | SABIC - Japan Method | yield |
Thermisch
Property | Temperature | Value | Comment |
---|---|---|---|
Heat deflection temperature, 1.80 MPa | 143 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 143 °C | ASTM D 648 | 6.4 mm, unannealed | |
Koeffizient der thermischen Ausdehnung | 23.0 °C | 2.7E-5 - 4.4E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 2.7E-5 - 4.4E-5 1/K | TMA | -30°C to 30°C |
Wärmeformbeständigkeitstemperatur | 143 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 143 °C |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Schmelzmassenflussrate | 19.8 g/10min Show Supplier Material materials with Schmelzmassenflussrate of 19.8 g/10min | ASTM D 1238 | 300°C/5.0 kgf | |
Schrumpfung | 23.0 °C | 0.2 % Show Supplier Material materials with Schrumpfung of 0.2 % | SABIC method | 3.2 mm |
Technological properties
Property | ||
---|---|---|
Application areas | Wireless Communications, Monitoring and Imaging, Personal Computing, Power Manangement, Pump, Electronic Components, Enclosure/Housing/Cover, Enclosures, EV Infrastructure, Document Handling, Data Transfer, Data Management, Air Conditioning | |
Availability | Asia | |
Processing methods | Drying Temperature: 110 to 120.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |