LNP™ STAT-KON™ Compound EE005E - Asia

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Description

LNP STAT-KON* EE005E is a compound based on Polyetherimide resin containing 25% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.36 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.23 %

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ISO 62 | (23°C / 50% RH)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

276 MPa

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ISO 178

Biegemodul

23.0 °C

15 GPa

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ISO 178

Dehnung

23.0 °C

1.4 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

18.2 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

53 J/m

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ASTM D 256

Impact strength, Izod unnotched, ASTM

23.0 °C

448 J/m

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ASTM D 4812 | 23°C

Instrumented Impact, at Peak

23.0 °C

10 J

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ASTM D 3763 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

6 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

29 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Zugfestigkeit

23.0 °C

194 MPa

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ISO 527 | break

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 1.80 MPa

207 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

1.92E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Wärmeformbeständigkeitstemperatur

207 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

2.71E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Elektrisch

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

100 - 100000 Ω

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ASTM D 257

Volume resistivity

23.0 °C

100 - 1000000 Ω·cm

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.1 %

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ISO 294 | 24 hrs

Schrumpfung, diagonal

23.0 °C

0.3 %

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ISO 294 | 24 hrs

Technological properties

Property
Application areas

Individual Equiptment, Data Transfer, Semiconductor

Availability

Asia,Americas

Processing methods

Back Pressure: 0.3 to 0.7MPa
Middle - Zone 2 Temperature: 370 to 390.0°C
Front - Zone 3 Temperature: 380 to 400.0°C
Drying Time: 4 to 6.0hrs
Rear - Zone 1 Temperature: 360 to 380.0°C
Maximum Moisture Content: 0.02%
Mold Temperature: 140 to 180.0°C
Melt Temperature: 360 to 400.0°C
Drying Temperature: 150°C
Nozzle Temperature: 390 to 400.0°C
Screw speed (Circumferential speed): 0.2 to 0.3m/s
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.