LNP™ THERMOTUF™ Compound W1000I

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Description

LNP THERMOTUF W1000I is a compound based on Polybutylene Terephthalate (PBT) resin. Added features include: High Impact

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Anwendungen

Elektrotechnik

Automobil

Konsumgüter

Haushaltselektrogeräte

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Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.22 g/cm³ Show Supplier Material materials with Dichte of 1.22 g/cm³	ISO 1183
Moisture absorption	23.0 °C	0.1 % Show Supplier Material materials with Moisture absorption of 0.1 %	ISO 62 \| (23°C / 50% RH)

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	46 MPa Show Supplier Material materials with Biegefestigkeit of 46 MPa	ISO 178 \| yield, 2 mm/min
Biegemodul	23.0 °C	1.6 GPa Show Supplier Material materials with Biegemodul of 1.6 GPa	ISO 178 \| 2 mm/min
Elastizitätsmodul	23.0 °C	1.5 GPa Show Supplier Material materials with Elastizitätsmodul of 1.5 GPa	ISO 527 \| 1 mm/min
Schlagzähigkeit, Izod gekerbt	23.0 °C	70 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 70 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Zugfestigkeit	23.0 °C	36 MPa Show Supplier Material materials with Zugfestigkeit of 36 MPa	ISO 527 \| yield, 5 mm/min

Thermisch

Property	Temperature	Value	Comment
Heat deflection temperature, 0.45 MPa		80 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 80 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		52 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 52 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Koeffizient der thermischen Ausdehnung	23.0 °C	1.4E-4 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 1.4E-4 1/K	ISO 11359-2 \| 23°C to 60°C
Wärmeformbeständigkeitstemperatur		52 - 80 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 52 - 80 °C
thermischer Ausdehnungskoeffizient, transversal	23.0 °C	1.32E-4 1/K Show Supplier Material materials with thermischer Ausdehnungskoeffizient, transversal of 1.32E-4 1/K	ISO 11359-2 \| 23°C to 60°C

Elektrisch

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	1.00E+15 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+15 Ω	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Schrumpfung	23.0 °C	2 % Show Supplier Material materials with Schrumpfung of 2 %	SABIC method

Technological properties

Property
Application areas	Wiring Devices, Refrigerator, Cooking Range, Heavy Vehicles
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120°C Drying Time: 4hrs Maximum Moisture Content: 0.05% Melt Temperature: 240 to 265.0°C Front - Zone 3 Temperature: 260 to 270.0°C Middle - Zone 2 Temperature: 245 to 255.0°C Rear - Zone 1 Temperature: 220 to 230.0°C Mold Temperature: 80 to 100.0°C Back Pressure: 0.2 to 0.3MPa Screw Speed: 30 to 60.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.