LNP™ THERMOCOMP™ Compound DF0061VI

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Description

LNP Thermocomp DF0061VI compound is a 30% glass fiber reinforced PC resin based LDS material solution with fast plating and stable RF performance. It is non chlorinated/brominated flame retardant. Wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

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SABIC

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Anwendungen

Elektrotechnik

Elektronik

Anzeigegeräte

Materialien von diesem Anbieter

LNP™ THERMOCOMP™ Compound WF006H

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LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.5 g/cm³ Show Supplier Material materials with Dichte of 1.5 g/cm³	ASTM D 792

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	150 MPa Show Supplier Material materials with Biegefestigkeit of 150 MPa	ISO 178 \| 2 mm/min
Biegemodul	23.0 °C	8.2 GPa Show Supplier Material materials with Biegemodul of 8.2 GPa	ISO 178 \| 2 mm/min
Dehnung	23.0 °C	2 % Show Supplier Material materials with Dehnung of 2 %	ISO 527 \| break, 5 mm/min
Elastizitätsmodul	23.0 °C	9.3 GPa Show Supplier Material materials with Elastizitätsmodul of 9.3 GPa	ISO 527 \| 1 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	70 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 70 J/m	ASTM D 256
Impact strength, Izod unnotched, ASTM	23.0 °C	400 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 400 J/m	ASTM D 4812 \| 23°C
Schlagfestigkeit, Charpy gekerbt	23.0 °C	7 kJ/m² Show Supplier Material materials with Schlagfestigkeit, Charpy gekerbt of 7 kJ/m²	ISO 179/1eA \| V-notch Edgew, 23°C, 80104 sp=62mm
Schlagzähigkeit, Izod gekerbt	23.0 °C	7 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 7 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Schlagzähigkeit, Izod ungekerbt	23.0 °C	30 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod ungekerbt of 30 kJ/m²	ISO 180/1U \| unnotched 80104
Zugfestigkeit	23.0 °C	106 MPa Show Supplier Material materials with Zugfestigkeit of 106 MPa	ISO 527 \| break, 5 mm/min

Thermisch

Property	Temperature	Value	Comment
Heat deflection temperature, 0.45 MPa		118 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 118 °C	ASTM D 648 \| 3.2 mm, unannealed
Heat deflection temperature, 1.80 MPa		115 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 115 °C	ASTM D 648 \| 3.2mm, unannealed
Koeffizient der thermischen Ausdehnung	23.0 °C	2.1E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 2.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Wärmeformbeständigkeitstemperatur		115 - 118 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 115 - 118 °C
thermischer Ausdehnungskoeffizient, transversal	23.0 °C	6.2E-5 1/K Show Supplier Material materials with thermischer Ausdehnungskoeffizient, transversal of 6.2E-5 1/K	ISO 11359-2 \| -40°C to 40°C

Elektrisch

Property	Temperature	Value	Comment
Dielectric constant, 10GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 10GHz of 3.52 [-]	SABIC method
Dielectric constant, 1GHz	23.0 °C	3.59 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.59 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.52 [-]	SABIC method
Dielektrizitätskonstante	23.0 °C	3.3 [-] Show Supplier Material materials with Dielektrizitätskonstante of 3.3 [-]	SABIC method \| 20 GHz
Dissipation factor, 1GHz	23.0 °C	9E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9E-3 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	8E-3 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 8E-3 [-]	SABIC method
Verlustfaktor	23.0 °C	8E-3 [-] Show Supplier Material materials with Verlustfaktor of 8E-3 [-]	SABIC method \| 20 GHz

Rheological Properties

Property	Temperature	Value	Comment
Schmelzmassenflussrate		13 g/10min Show Supplier Material materials with Schmelzmassenflussrate of 13 g/10min	ASTM D 1238 \| 300°C/1.2 kgf
Schrumpfung	23.0 °C	0.1 % Show Supplier Material materials with Schrumpfung of 0.1 %	SABIC method
Schrumpfung, diagonal	23.0 °C	0.1 % Show Supplier Material materials with Schrumpfung, diagonal of 0.1 %	SABIC method

Technological properties

Property
Application areas	Electronic Components, Personal Computing, Wearables, Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Drying Time: 3 to 4.0hrs Melt Temperature: 290 to 310.0°C Nozzle Temperature: 285 to 310.0°C Front - Zone 3 Temperature: 285 to 310.0°C Middle - Zone 2 Temperature: 285 to 310.0°C Rear - Zone 1 Temperature: 285 to 310.0°C Mold Temperature: 100 to 130.0°C Back Pressure: 0.1 to 0.3MPa Screw Speed: 50 to 150.0rpm Drying Temperature: 110 to 120.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.