LNP™ THERMOTUF™ Compound WF008N

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Description

LNP THERMOTUF WF008N is a PBT based compound containing 40% glass for NMT application. Added features of this material include: high modulus, high metal bonding strength, and good chemical resistance.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.58 g/cm³

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ISO 1183

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

217 MPa

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ISO 178 | break, 2 mm/min

Biegemodul

23.0 °C

11.2 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

2.5 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

11.7 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

145 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

960 J/m

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ASTM D 4812 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

11 kJ/m²

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ISO 180/1A | notched 80*10*4, -30°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

59 kJ/m²

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ISO 180/1U | unnotched 80*10*4, 23°C

Zugfestigkeit

23.0 °C

134 MPa

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ISO 527 | break, 5 mm/min

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 0.45 MPa

218 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

196 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

1.7E-5 1/K

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ISO 11359-2 | 23°C to 50°C

Relative temperature index, electrical

75 °C

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UL 746B

Relative temperature index, mechanical impact

75 °C

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UL 746B

Relative temperature index, mechanical strength

75 °C

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UL 746B

Wärmeformbeständigkeitstemperatur

196 - 218 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

8.9E-5 1/K

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ISO 11359-2 | 23°C to 50°C

Entflammbarkeit

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=104061413- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.7mm UL 94

Elektrisch

PropertyTemperatureValueComment

Dielectric constant, 10GHz

23.0 °C

3.8 [-]

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SABIC method

Dielectric constant, 1GHz

23.0 °C

3.78 [-]

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SABIC method | 1.1 GHz

Dielectric constant, 5GHz

23.0 °C

3.73 [-]

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SABIC method

Dielektrizitätskonstante

23.0 °C

3.76 [-]

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SABIC method | 1.9 GHz

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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SABIC method |

Dissipation factor, 5GHz

23.0 °C

9.1E-3 [-]

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SABIC method

Verlustfaktor

23.0 °C

9.6E-3 [-]

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SABIC method

Rheological Properties

PropertyTemperatureValueComment

Schmelzmassenflussrate

10 g/10min

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ASTM D 1238 | 250°C/5.0 kgf

Schmelzvolumenflussrate

7 cm³/10min

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ISO 1133 | MVR at 250°C/5.0 kg

Schrumpfung

23.0 °C

0.25 %

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SABIC method

Schrumpfung, diagonal

23.0 °C

0.65 %

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SABIC method

Technological properties

Property
Application areas

Electronic Components, Wireless Communications, Personal Computing

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 100 to 120.0°C
Drying Time: 2 to 4.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 250 to 270.0°C
Nozzle Temperature: 255 to 275.0°C
Front - Zone 3 Temperature: 250 to 270.0°C
Middle - Zone 2 Temperature: 250 to 270.0°C
Rear - Zone 1 Temperature: 240 to 260.0°C
Hopper Temperature: 40 to 60.0°C
Mold Temperature: 100 to 160.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.