LNP™ THERMOCOMP™ Compound UF0067V

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Description

LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications. Additional feature is high heat such that articles made of it can survive SMT process.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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SABIC

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Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Anwendungen

Elektrotechnik

Elektronik

Anzeigegeräte

Materialien von diesem Anbieter

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LNP™ ELCRES™ CRX9411

Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Relative Dichte	23.0 °C	1.45 [-] Show Supplier Material materials with Relative Dichte of 1.45 [-]	ASTM D 792
Wasserabsorption	23.0 °C	0.05 % Show Supplier Material materials with Wasserabsorption of 0.05 %	ISO 62-1 \| (23°C/24hrs)

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	150 MPa Show Supplier Material materials with Biegefestigkeit of 150 MPa	ASTM D 790 \| yld, 1.3 mm/min, 50 mm span
Biegemodul	23.0 °C	8.5 GPa Show Supplier Material materials with Biegemodul of 8.5 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Dehnung	23.0 °C	1.6 % Show Supplier Material materials with Dehnung of 1.6 %	ASTM D 638 \| brk, Type I, 5 mm/min
Elastizitätsmodul	23.0 °C	9.5 GPa Show Supplier Material materials with Elastizitätsmodul of 9.5 GPa	ASTM D 638 \| 5 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	34 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 34 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	300 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 300 J/m	ASTM D 4812 \| 23°C
Schlagzähigkeit, Izod gekerbt	23.0 °C	34 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 34 kJ/m²	ASTM D 256 \| notched, 23°C
Zugfestigkeit	23.0 °C	104 MPa Show Supplier Material materials with Zugfestigkeit of 104 MPa	ASTM D 638 \| brk, Type I, 5 mm/min

Thermisch

Property	Value	Comment
Heat deflection temperature, 0.45 MPa	276 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 276 °C	ASTM D 648 \| 3.2 mm
Heat deflection temperature, 1.80 MPa	255 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 255 °C	ASTM D 648 \| 1.82 MPa, 3.2 mm
Relative temperature index, electrical	65 °C Show Supplier Material materials with Relative temperature index, electrical of 65 °C	UL 746B
Relative temperature index, mechanical impact	65 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 65 °C	UL 746B
Relative temperature index, mechanical strength	65 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 65 °C	UL 746B
Wärmeformbeständigkeitstemperatur	255 - 276 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 255 - 276 °C
Entflammbarkeit	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103351790- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.4mm UL 94

Elektrisch

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	3.56 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.56 [-]	SABIC method \| 1.1 GHz
Dissipation factor, 1GHz	23.0 °C	9E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9E-3 [-]	SABIC method \|

Rheological Properties

Property	Temperature	Value	Comment
Schrumpfung	23.0 °C	0.3 % Show Supplier Material materials with Schrumpfung of 0.3 %	SABIC method
Schrumpfung, diagonal	23.0 °C	0.5 % Show Supplier Material materials with Schrumpfung, diagonal of 0.5 %	SABIC method

Technological properties

Property
Application areas	Antenna
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120°C Drying Time: 4 to 7.0hrs Melt Temperature: 290 to 330.0°C Nozzle Temperature: 300 to 320.0°C Front - Zone 3 Temperature: 300 to 320.0°C Middle - Zone 2 Temperature: 280 to 300.0°C Rear - Zone 1 Temperature: 260 to 280.0°C Mold Temperature: 120 to 150.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.