LNP™ STAT-KON™ Compound 9X08403C

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Description

LNP STAT-KON 9X08403C is a compound based on Liquid Crystal Polymer (LCP) resin containing Carbon Fiber. Added features of this material are: Clean Compounding System, High Temperature, Flame Retardant, Electrically Conductive, Good barrier against water and oxygen.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

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Anwendungen

Elektronik

Materialien von diesem Anbieter

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.46 g/cm³ Show Supplier Material materials with Dichte of 1.46 g/cm³	ASTM D 792
Relative Dichte	23.0 °C	1.46 [-] Show Supplier Material materials with Relative Dichte of 1.46 [-]	ASTM D 792 \|

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	53 MPa Show Supplier Material materials with Biegefestigkeit of 53 MPa	ASTM D 790
Biegemodul	23.0 °C	14.4 GPa Show Supplier Material materials with Biegemodul of 14.4 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Dehnung	23.0 °C	2.7 % Show Supplier Material materials with Dehnung of 2.7 %	ASTM D 638 \| yld, Type I, 5 mm/min
Elastizitätsmodul	23.0 °C	14.8 GPa Show Supplier Material materials with Elastizitätsmodul of 14.8 GPa	ASTM D 638 \| 5 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	87 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 87 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	826 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 826 J/m	ASTM D 4812 \| 23°C
Schlagzähigkeit, Izod gekerbt	23.0 °C	87 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 87 kJ/m²	ASTM D 256 \| notched, 23°C
Zugfestigkeit	23.0 °C	153 MPa Show Supplier Material materials with Zugfestigkeit of 153 MPa	ASTM D 638 \| yld, Type I, 5 mm/min

Thermisch

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	280 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 280 °C	ASTM D 648 \| 3.2mm, unannealed
Wärmeformbeständigkeitstemperatur	280 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 280 °C

Elektrisch

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	1.00E+5 - 1.00E+9 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+5 - 1.00E+9 Ω	ASTM D 257
Volume resistivity	23.0 °C	1.00E+5 - 1.00E+9 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+5 - 1.00E+9 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Schrumpfung	23.0 °C	0.2 % Show Supplier Material materials with Schrumpfung of 0.2 %	SABIC method
Schrumpfung, diagonal	23.0 °C	0.52 % Show Supplier Material materials with Schrumpfung, diagonal of 0.52 %	SABIC method

Technological properties

Property
Application areas	Semiconductor
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120 to 150.0°C Drying Time: 1 to 3.0hrs Maximum Moisture Content: 0.01% Melt Temperature: 330 to 360.0°C Nozzle Temperature: 330 to 360.0°C Front - Zone 3 Temperature: 330 to 360.0°C Middle - Zone 2 Temperature: 330 to 360.0°C Rear - Zone 1 Temperature: 325 to 360.0°C Mold Temperature: 65 to 110.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.