Allgemein
Property | Temperature | Value | Comment |
---|---|---|---|
Dichte | 23.0 °C | 2.14 g/cm³ Show Supplier Material materials with Dichte of 2.14 g/cm³ | ASTM D 792 |
Mechanisch
Property | Temperature | Value | Comment |
---|---|---|---|
Biegefestigkeit | 23.0 °C | 185 MPa Show Supplier Material materials with Biegefestigkeit of 185 MPa | ASTM D 790 | yld, 1.3 mm/min, 50 mm span |
Biegemodul | 23.0 °C | 11.5 GPa Show Supplier Material materials with Biegemodul of 11.5 GPa | ASTM D 790 | 1.3 mm/min, 50 mm span |
Dehnung | 23.0 °C | 1.4 % Show Supplier Material materials with Dehnung of 1.4 % | ASTM D 638 | brk, Type I, 5 mm/min |
Elastizitätsmodul | 23.0 °C | 13.8 GPa Show Supplier Material materials with Elastizitätsmodul of 13.8 GPa | ASTM D 638 | 5 mm/min |
Impact strength, Izod notched, ASTM | 23.0 °C | 40 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 40 J/m | ASTM D 256 |
Schlagzähigkeit, Izod gekerbt | 23.0 °C | 40 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 40 kJ/m² | ASTM D 256 | notched, 23°C |
Zugfestigkeit | 23.0 °C | 125 MPa Show Supplier Material materials with Zugfestigkeit of 125 MPa | ASTM D 638 | brk, Type I, 5 mm/min |
Thermisch
Elektrisch
Rheological Properties
Technological properties
Property | ||
---|---|---|
Availability | Europe,Asia,Americas | |
Processing methods | Drying Temperature: 120 to 130.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |