Eigenschaften
Allgemein
| Property | Temperature | Value | Comment |
|---|---|---|---|
Relative Dichte | 23.0 °C | 1.31 [-] Show Supplier Material materials with Relative Dichte of 1.31 [-] | ASTM D 792 | |
Mechanisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Biegefestigkeit | 23.0 °C | 127 MPa Show Supplier Material materials with Biegefestigkeit of 127 MPa | ASTM D 790 |
Biegemodul | 23.0 °C | 3.7 GPa Show Supplier Material materials with Biegemodul of 3.7 GPa | ASTM D 790 |
Dehnung | 23.0 °C | 4 % Show Supplier Material materials with Dehnung of 4 % | SABIC - Japan Method | break |
Impact strength, Izod notched, ASTM | 23.0 °C | 29 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 29 J/m | ASTM D 256 |
Schlagzähigkeit, Izod gekerbt | 23.0 °C | 29 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 29 kJ/m² | ASTM D 256 | notched, 23°C |
Zugfestigkeit | 23.0 °C | 84 MPa Show Supplier Material materials with Zugfestigkeit of 84 MPa | SABIC - Japan Method | yield |
Thermisch
Elektrisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Sheet resistivity, ROA | 23.0 °C | 1.00E+10 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+10 Ω | ASTM D 257 |
Rheological Properties
| Property | Temperature | Value | Comment |
|---|---|---|---|
Schrumpfung | 23.0 °C | 0.5 % Show Supplier Material materials with Schrumpfung of 0.5 % | SABIC method | 3.2 mm |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Semiconductor | |
| Availability | Europe,Asia,Americas | |
| Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. | |