LNP™ THERMOCOMP™ Compound UF0067W

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Description

LNP THERMOCOMP UF0067W is a compound based on Polyphthalamide resin containing 30% glass fiber. Added features of this material include: Hot Water Moldable, Non-Brominated & Non-Chlorinated Flame Retardant.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.45 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.2 %

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ASTM D 570 | (23°C/50% RH/24 hrs)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

189 MPa

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ISO 178

Biegemodul

23.0 °C

9.1 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

1.9 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

11.3 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

64 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

662 J/m

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ASTM D 4812 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

5 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

32 kJ/m²

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ISO 180/1U | unnotched 80*10*4, 23°C

Zugfestigkeit

23.0 °C

128 MPa

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ISO 527 | break, 5 mm/min

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 0.45 MPa

299 °C

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ASTM D 648 | 3.2 mm, unannealed

Heat deflection temperature, 1.80 MPa

277 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

2.5E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Relative temperature index, electrical

125 °C

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UL 746B

Relative temperature index, mechanical impact

50 °C

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UL 746B

Relative temperature index, mechanical strength

125 °C

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UL 746B

Wärmeformbeständigkeitstemperatur

277 - 299 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

5.11E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Entflammbarkeit

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101284114- - <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=103093678- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥1.5mm UL 94 <br> UL Recognized, 94V-1 Flame Class Rating: ≥1mm UL 94

Elektrisch

PropertyTemperatureValueComment

Dielektrizitätskonstante, 1 MHz

23.0 °C

3.82 [-]

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ASTM D 150

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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ASTM D 150 |

Dissipation factor, 1kHz

23.0 °C

0.01 [-]

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ASTM D 150

Durchschlagfestigkeit

23.0 °C

29.7 kV/mm

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ASTM D 149 | in oil, 0.8 mm

High Volt Arc Track Rate

23.0 °C

2 PLC Code

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UL 746A | (PLC)

Kriechstromfestigkeit

23.0 °C

0 V

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UL 746A | (UL) {PLC}

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.2 %

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ISO 294 | 24 hrs

Schrumpfung, diagonal

23.0 °C

1.2 %

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ISO 294 | 24 hrs

Technological properties

Property
Application areas

Electronic Components, Data Transfer

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 90 to 110.0°C
Drying Time: 3 to 5.0hrs
Melt Temperature: 280 to 320.0°C
Nozzle Temperature: 280 to 320.0°C
Front - Zone 3 Temperature: 280 to 320.0°C
Middle - Zone 2 Temperature: 280 to 320.0°C
Rear - Zone 1 Temperature: 250 to 280.0°C
Mold Temperature: 90 to 120.0°C
Back Pressure: 1 to 5.0MPa
Screw Speed: 30 to 100.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.