LNP™ THERMOCOMP™ Compound NX10302

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Description

This is a PC/ABS compound with improved plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Anwendungen

Elektrotechnik

Elektronik

Anzeigegeräte

Materialien von diesem Anbieter

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.26 g/cm³ Show Supplier Material materials with Dichte of 1.26 g/cm³	ASTM D 792
Moisture absorption	23.0 °C	0.02 % Show Supplier Material materials with Moisture absorption of 0.02 %	ASTM D 570 \| (23°C/50% RH/24 hrs)
Wasserabsorption	23.0 °C	0.01 % Show Supplier Material materials with Wasserabsorption of 0.01 %	ASTM D 570 \| (23°C/24hrs)

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	80 MPa Show Supplier Material materials with Biegefestigkeit of 80 MPa	ASTM D 790 \| yld, 1.3 mm/min, 50 mm span
Biegemodul	23.0 °C	2.4 GPa Show Supplier Material materials with Biegemodul of 2.4 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Dehnung	23.0 °C	4.2 % Show Supplier Material materials with Dehnung of 4.2 %	ASTM D 638 \| yld, Type I, 5 mm/min
Elastizitätsmodul	23.0 °C	2.5 GPa Show Supplier Material materials with Elastizitätsmodul of 2.5 GPa	ASTM D 638 \| 50 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	600 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 600 J/m	ASTM D 256 \| notched, 23°C
Schlagzähigkeit, Izod gekerbt	23.0 °C	600 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 600 kJ/m²	ASTM D 256 \| notched, 23°C
Zugfestigkeit	23.0 °C	47 MPa Show Supplier Material materials with Zugfestigkeit of 47 MPa	ASTM D 638 \| brk, Type I, 5 mm/min
Impact strength, Izod unnotched, ASTM	ASTM D 4812 \| 23°C

Thermisch

Property	Temperature	Value	Comment
Heat deflection temperature, 1.80 MPa		108 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 108 °C	ASTM D 648 \| 3.2mm, unannealed
Koeffizient der thermischen Ausdehnung	23.0 °C	8.47E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 8.47E-5 1/K	ASTM E 831 \| -40°C to 40°C
Relative temperature index, electrical		60 °C Show Supplier Material materials with Relative temperature index, electrical of 60 °C	UL 746B
Relative temperature index, mechanical impact		60 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 60 °C	UL 746B
Relative temperature index, mechanical strength		60 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 60 °C	UL 746B
Wärmeformbeständigkeitstemperatur		108 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 108 °C
thermischer Ausdehnungskoeffizient, transversal	23.0 °C	9.1E-5 1/K Show Supplier Material materials with thermischer Ausdehnungskoeffizient, transversal of 9.1E-5 1/K	ASTM E 831 \| -40°C to 40°C
Entflammbarkeit	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101343771- - <br> UL Recognized, 94HB Flame Class Rating: 0.6mm UL 94

Elektrisch

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	2.74 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 2.74 [-]	IEC 60250
Dissipation factor, 1GHz	23.0 °C	3E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 3E-3 [-]	IEC 60250

Rheological Properties

Property	Temperature	Value	Comment
Schmelzvolumenflussrate		14 cm³/10min Show Supplier Material materials with Schmelzvolumenflussrate of 14 cm³/10min	ISO 1133 \| MVR at 260°C/5.0 kg
Schrumpfung	23.0 °C	0.6 % Show Supplier Material materials with Schrumpfung of 0.6 %	ASTM D 955 \| 24 hrs
Schrumpfung, diagonal	23.0 °C	0.5 % Show Supplier Material materials with Schrumpfung, diagonal of 0.5 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Wireless Communications, Wearables, Personal Computing, Electronic Components, Enclosures, Enclosure/Housing/Cover, Data Transfer, Audio
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 85 to 100.0°C Drying Time: 6 to 8.0hrs Melt Temperature: 250 to 290.0°C Nozzle Temperature: 250 to 290.0°C Front - Zone 3 Temperature: 250 to 280.0°C Middle - Zone 2 Temperature: 250 to 270.0°C Rear - Zone 1 Temperature: 250 to 270.0°C Mold Temperature: 60 to 90.0°C Back Pressure: 0.3 to 0.7MPa Screw Speed: 40 to 70.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.