LNP™ THERMOCOMP™ Compound DX13354

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Description

LNP* Thermocomp* DX13354 compound is a 30% glass fiber reinforced, impact modified PC resin based LDS material solution with stable plating and RF performance. Good surface aesthetics and wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

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Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Anwendungen

Elektronik

Anzeigegeräte

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Sehen Sie alle Materialen dieses Anbieters

Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Relative Dichte	23.0 °C	1.47 [-] Show Supplier Material materials with Relative Dichte of 1.47 [-]	ASTM D 792 \|

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	180 MPa Show Supplier Material materials with Biegefestigkeit of 180 MPa	ISO 178
Biegemodul	23.0 °C	8.5 GPa Show Supplier Material materials with Biegemodul of 8.5 GPa	ISO 178
Dehnung	23.0 °C	2.4 % Show Supplier Material materials with Dehnung of 2.4 %	ISO 527 \| break, 50 mm/min
Elastizitätsmodul	23.0 °C	8.8 GPa Show Supplier Material materials with Elastizitätsmodul of 8.8 GPa	ISO 527 \| 1 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	150 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 150 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	700 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 700 J/m	ASTM D 4812 \| 23°C
Schlagfestigkeit, Charpy gekerbt	23.0 °C	14 kJ/m² Show Supplier Material materials with Schlagfestigkeit, Charpy gekerbt of 14 kJ/m²	ISO 179/2C \| 23°C
Schlagzähigkeit, Charpy ungekerbt	23.0 °C	50 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Charpy ungekerbt of 50 kJ/m²	ISO 179/2C \| 23°C
Schlagzähigkeit, Izod gekerbt	23.0 °C	14 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 14 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Schlagzähigkeit, Izod ungekerbt	23.0 °C	40 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod ungekerbt of 40 kJ/m²	ISO 180/1U \| unnotched 80104
Zugfestigkeit	23.0 °C	120 MPa Show Supplier Material materials with Zugfestigkeit of 120 MPa	ISO 527 \| break, 50 mm/min

Thermisch

Property	Temperature	Value	Comment
Heat deflection temperature, 0.45 MPa		127 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 127 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		124 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 124 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Koeffizient der thermischen Ausdehnung	23.0 °C	2.1E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 2.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Wärmeformbeständigkeitstemperatur		124 - 127 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 124 - 127 °C
thermischer Ausdehnungskoeffizient, transversal	23.0 °C	7.1E-5 1/K Show Supplier Material materials with thermischer Ausdehnungskoeffizient, transversal of 7.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C

Elektrisch

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.52 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.51 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.51 [-]	SABIC method
Dielektrizitätskonstante	23.0 °C	3.44 [-] Show Supplier Material materials with Dielektrizitätskonstante of 3.44 [-]	SABIC method \| 1.9 GHz
Dissipation factor, 1GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 0.01 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 0.01 [-]	SABIC method
Verlustfaktor	23.0 °C	0.01 [-] Show Supplier Material materials with Verlustfaktor of 0.01 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Schmelzmassenflussrate		10 g/10min Show Supplier Material materials with Schmelzmassenflussrate of 10 g/10min	ASTM D 1238 \| 280°C/2.16 kgf
Schmelzvolumenflussrate		13 cm³/10min Show Supplier Material materials with Schmelzvolumenflussrate of 13 cm³/10min	ASTM D 1238 \| MVR at 300°C/1.2 kg
Schrumpfung	23.0 °C	0.05 % Show Supplier Material materials with Schrumpfung of 0.05 %	SABIC method \| 3.2 mm
Schrumpfung, diagonal	23.0 °C	0.2 % Show Supplier Material materials with Schrumpfung, diagonal of 0.2 %	SABIC method \| 3.2 mm

Technological properties

Property
Application areas	Antenna
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 110°C Drying Time: 3 to 4.0hrs Melt Temperature: 270 to 295.0°C Nozzle Temperature: 270 to 295.0°C Front - Zone 3 Temperature: 270 to 295.0°C Middle - Zone 2 Temperature: 270 to 295.0°C Rear - Zone 1 Temperature: 270 to 295.0°C Mold Temperature: 100 to 120.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.