Allgemein
Mechanisch
Property | Temperature | Value | Comment |
---|---|---|---|
Biegefestigkeit | 23.0 °C | 160 MPa Show Supplier Material materials with Biegefestigkeit of 160 MPa | ASTM D 790 |
Biegemodul | 23.0 °C | 6 GPa Show Supplier Material materials with Biegemodul of 6 GPa | ASTM D 790 |
Dehnung | 23.0 °C | 4 - 6 % Show Supplier Material materials with Dehnung of 4 - 6 % | SABIC - Japan Method | break |
Härte, Rockwell M | 23.0 °C | 88 [-] Show Supplier Material materials with Härte, Rockwell M of 88 [-] | ASTM D 785 | |
Impact strength, Izod notched, ASTM | 23.0 °C | 88 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 88 J/m | ASTM D 256 | notched, 23°C |
Schlagzähigkeit, Izod gekerbt | 23.0 °C | 88 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 88 kJ/m² | ASTM D 256 | notched, 23°C |
Zugfestigkeit | 23.0 °C | 98 MPa Show Supplier Material materials with Zugfestigkeit of 98 MPa | SABIC - Japan Method | yield |
Thermisch
Property | Temperature | Value | Comment |
---|---|---|---|
Heat deflection temperature, 0.45 MPa | 142 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 142 °C | ASTM D 648 | 3.2 mm, unannealed | |
Koeffizient der thermischen Ausdehnung | 23.0 °C | 3.5E-5 - 5.9E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 3.5E-5 - 5.9E-5 1/K | TMA | -30°C to 30°C |
Wärmeformbeständigkeitstemperatur | 142 °C Show Supplier Material materials with Wärmeformbeständigkeitstemperatur of 142 °C |
Elektrisch
Property | Temperature | Value | Comment |
---|---|---|---|
Sheet resistivity, ROA | 23.0 °C | 1.00E+8 - 1.00E+12 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+8 - 1.00E+12 Ω | ASTM D 257 |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Schrumpfung | 23.0 °C | 0.2 % Show Supplier Material materials with Schrumpfung of 0.2 % | SABIC method | 3.2 mm |
Technological properties
Property | ||
---|---|---|
Application areas | Smart/ID Card, Personal Computing, Data Transfer, Electronic Components, Enclosure/Housing/Cover | |
Availability | Europe,Asia,Americas | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |