Allgemein
Property | Temperature | Value | Comment |
---|---|---|---|
Relative Dichte | 23.0 °C | 1.06 [-] Show Supplier Material materials with Relative Dichte of 1.06 [-] | ASTM D 792 | |
Mechanisch
Property | Temperature | Value | Comment |
---|---|---|---|
Biegefestigkeit | 23.0 °C | 76 MPa Show Supplier Material materials with Biegefestigkeit of 76 MPa | ASTM D 790 |
Biegemodul | 23.0 °C | 2.1 GPa Show Supplier Material materials with Biegemodul of 2.1 GPa | ASTM D 790 |
Dehnung | 23.0 °C | 42 % Show Supplier Material materials with Dehnung of 42 % | SABIC - Japan Method | break |
Impact strength, Izod notched, ASTM | 23.0 °C | 330 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 330 J/m | ASTM D 256 |
Schlagzähigkeit, Izod gekerbt | 23.0 °C | 330 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod gekerbt of 330 kJ/m² | ASTM D 256 | notched, 23°C |
Zugfestigkeit | 23.0 °C | 48 MPa Show Supplier Material materials with Zugfestigkeit of 48 MPa | SABIC - Japan Method | yield |
Thermisch
Rheological Properties
Property | Value | Comment |
---|---|---|
Schmelzmassenflussrate | 3.8 g/10min Show Supplier Material materials with Schmelzmassenflussrate of 3.8 g/10min | ASTM D 1238 | 250°C/10.0 kgf |
Technological properties
Property | ||
---|---|---|
Application areas | Tray, Food Transportation, Industrial Material Handling | |
Availability | Asia | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |