ULTEM™ Resin SF2250 - Americas

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Description

High flow ULTEM for thin wall application

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.44 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.07 %

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23°C/50%

Relative Dichte

23.0 °C

1.44 [-]

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ASTM D 792 |

Wasserabsorption

23.0 °C

0.2 %

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ISO 62-1 | (23°C/24hrs)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

197 MPa

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ASTM D 790 | yld, 1.3 mm/min, 50 mm span

Biegemodul

23.0 °C

7.2 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

3 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

8.9 GPa

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ASTM D 638 | 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

89 J/m

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ASTM D 256

Schlagzähigkeit, Izod gekerbt

23.0 °C

9 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Zugfestigkeit

23.0 °C

157 MPa

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ISO 527 | break, 5 mm/min

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 1.80 MPa

208 °C

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ISO 75/Ae | Edgew 120*10*4 sp=100mm

Koeffizient der thermischen Ausdehnung

23.0 °C

1.8E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Wärmeformbeständigkeitstemperatur

208 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

5.9E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Entflammbarkeit

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=100116343- -

Rheological Properties

PropertyTemperatureValueComment

Schmelzmassenflussrate

19.7 g/10min

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ASTM D 1238 | 337°C/6.6 kgf

Schmelzvolumenflussrate

40 cm³/10min

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ISO 1133 | MVR at 345°C/10.0 kg

Schrumpfung

23.0 °C

0.46 %

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SABIC method

Schrumpfung, diagonal

23.0 °C

0.54 %

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SABIC method

Technological properties

Property
Application areas

Photo/Video Camera, Semiconductor, Electronic Components, Circuit Protection, Additive Semiconductor Materials

Availability

Europe,Asia,Americas

Processing methods

Shot to Cylinder Size: 40 to 60.0%
Drying Time (Cumulative): 24hrs
Nozzle Temperature: 345 to 400.0°C
Back Pressure: 0.3 to 0.7MPa
Maximum Moisture Content: 0.02%
Front - Zone 3 Temperature: 345 to 400.0°C
Middle - Zone 2 Temperature: 340 to 400.0°C
Drying Time: 4 to 6.0hrs
Drying Temperature: 150°C
Melt Temperature: 350 to 400.0°C
Mold Temperature: 135 to 165.0°C
Vent Depth: 0.025 to 0.076mm
Rear - Zone 1 Temperature: 330 to 400.0°C
Screw Speed: 40 to 70.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.