LEXAN™ Copolymer MPX1 - Asia

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Description

Lexan* MPX1 polycarbonate (PC) siloxane copolymer resin is a UV stabilized injection molding (IM) grade with release properties. This resin offers good low temperature ductility in combination with high flow characteristics and excellent processability with opportunities for shorter IM cycle times compared to standard IM PC resins. Lexan MPX1 resin is a general purpose product available in limited colors and may be an excellent candidate for a broad range of applications.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.19 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.09 %

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ISO 62 | (23°C / 50% RH)

Relative Dichte

23.0 °C

1.18 [-]

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ASTM D 792 |

Wasserabsorption

23.0 °C

0.12 %

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ISO 62-1 | (23°C/saturated)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

86 MPa

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ASTM D 790 | yld, 1.3 mm/min, 50 mm span

Biegemodul

23.0 °C

2.1 GPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Dehnung

23.0 °C

4.8 %

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ASTM D 638 | yld, Type I, 50 mm/min

Elastizitätsmodul

23.0 °C

2.1 GPa

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ASTM D 638 | 50 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

250 J/m

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ASTM D 256

Instrumented Impact, Total Energy

23.0 °C

70 J

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ASTM D 3763 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

750 kJ/m²

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ASTM D 256 | notched, 23°C

Zugfestigkeit

23.0 °C

57 MPa

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ASTM D 638 | yld, Type I, 50 mm/min

Thermisch

PropertyValueComment

Ball Pressure Test

pass

IEC 60695-10-2 | 125°C +/- 2°C

Heat deflection temperature, 1.80 MPa

116 °C

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ASTM D 648 | 3.2mm, unannealed

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Vicat-Erweichungstemperatur

139 °C

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ISO 306 | Rate B/120

Wärmeformbeständigkeitstemperatur

116 °C

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Entflammbarkeit

UL Recognized, 94HB Flame Class Rating: ≥0.5mm UL 94 <br> Glow Wire Ignitability Temperature, 1.0 mm: 850°C IEC 60695-2-13 <br> Glow Wire Flammability Index, 1.0 mm: 960°C IEC 60695-2-12 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102102564- -

Rheological Properties

PropertyTemperatureValueComment

Schmelzmassenflussrate

18 g/10min

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ASTM D 1238 | 300°C/1.2 kgf

Schmelzvolumenflussrate

17 cm³/10min

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ISO 1133 | MVR at 300°C/1.2 kg

Schrumpfung

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Schrumpfung, diagonal

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Wireless Communications, Wearables, Enclosures

Availability

Asia

Processing methods

Drying Time: 3 to 4.0hrs
Middle - Zone 2 Temperature: 280 to 305.0°C
Screw Speed: 40 to 70.0rpm
Rear - Zone 1 Temperature: 270 to 295.0°C
Drying Time (Cumulative): 48hrs
Front - Zone 3 Temperature: 295 to 315.0°C
Melt Temperature: 295 to 315.0°C
Back Pressure: 0.3 to 0.7MPa
Nozzle Temperature: 290 to 310.0°C
Drying Temperature: 120°C
Vent Depth: 0.025 to 0.076mm
Maximum Moisture Content: 0.02%
Mold Temperature: 70 to 95.0°C
Shot to Cylinder Size: 40 to 60.0%

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.