LNP™ THERMOCOMP™ Compound LF006E - Americas

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Description

LNP THERMOCOMP LF006E is a compound based on Polyetheretherketone resin containing 30% Glass Fiber. Added features of this material include: Easy Molding.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.53 g/cm³

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ISO 1183

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

278 MPa

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ISO 178

Biegemodul

23.0 °C

12.5 GPa

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ISO 178

Dehnung

23.0 °C

2 %

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ISO 527 | break

Elastizitätsmodul

23.0 °C

12.9 GPa

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ISO 527 | 1 mm/min

Schlagzähigkeit, Izod gekerbt

23.0 °C

11 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

58 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Zugfestigkeit

23.0 °C

187 MPa

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ISO 527 | break

Technological properties

Property
Application areas

Electronic Components, Enclosures, Heavy Vehicles, Air Cabin Interiors, Oil/Gas

Availability

Europe,Americas

Processing methods

Front - Zone 3 Temperature: 380 to 400.0°C
Back Pressure: 0.3 to 0.7MPa
Middle - Zone 2 Temperature: 380 to 400.0°C
Screw Speed: 60 to 100.0rpm
Drying Time: 4 to 6.0hrs
Drying Temperature: 150°C
Rear - Zone 1 Temperature: 370 to 380.0°C
Mold Temperature: 175 to 190.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.