AuSi2 hard-as-rolled

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Description

Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuSi (1... 3%) is an introduced material for soldering Si semiconductor chips to the substrate (copper or metallized ceramics). With the special solder material AuSi3, connections of the highest stability and temperature cycle stability are achieved when soldering the Si chips to the system carrier or housing.

Related Standards

Diese Materialdaten wurden von WIAM zur Verfügung gestellt

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Eigenschaften

Allgemein

PropertyTemperatureValue

Dichte

20.0 °C

14.5 g/cm³

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Mechanisch

PropertyTemperatureValueComment

Dehnung

20.0 °C

0.5 - 3 %

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Elastizitätsmodul

23.0 °C

74 - 81 GPa

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Typical for Gold

Poissonzahl

23.0 °C

0.42 [-]

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Typical for Gold

Schubmodule

23.0 °C

26 GPa

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Typical for Gold

Streckgrenze

20.0 °C

500 - 600 MPa

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Thermisch

PropertyTemperatureValueComment

Koeffizient der thermischen Ausdehnung

23.0 °C

1.4E-5 1/K

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Typical for Gold

Schmelzpunkt

1064 °C

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Typical for Gold

Spezifische Wärmekapazität

23.0 °C

126 - 138 J/(kg·K)

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Typical for Gold

Wärmeleitfähigkeit

20.0 °C

50 W/(m·K)

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Elektrisch

PropertyTemperatureValue

Elektrische Leitfähigkeit

20.0 °C

3.30E+7 S/m

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spezifischer Widerstand

20.0 °C

3.1E-8 Ω·m

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Chemical properties

PropertyValue

Gold

98 %

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Silizium

2 %

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