EN 1652 Grade Cu-ETP R360

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Description

Cu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. To the comparable DIN-mark E-Cu58, mat. No 2.0065 acc. to DIN 1787 : 1973-01 applies: The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValue

Densidad

20.0 °C

8.9 - 8.94 g/cm³

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Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

20.0 °C

0.34 [-]

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Elongación

20.0 °C

3 %

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Elongación A50

20.0 °C

2 %

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Límite elástico Rp 0,2

20.0 °C

320 MPa

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Módulo de cizallamiento

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Módulo elástico

20.0 °C

127 GPa

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Resistencia a la tracción

20.0 °C

360 MPa

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Aplicaciones térmicas

PropertyTemperatureValueComment

Calor específico

-150.0 °C

282 J/(kg·K)

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-50.0 °C

361 J/(kg·K)

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20.0 °C

386 J/(kg·K)

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Coeficiente de dilatación térmica

100.0 °C

1.68E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.77E-5 1/K

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Conductividad térmica

-253.0 °C

1298 W/(m·K)

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-200.0 °C

574 W/(m·K)

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-100.0 °C

435 W/(m·K)

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20.0 °C

390 - 394 W/(m·K)

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100.0 °C

385 W/(m·K)

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200.0 °C

381 W/(m·K)

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300.0 °C

377 W/(m·K)

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Temperatura de fusión

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Chemical properties

PropertyValue

Bismuto

5E-4 %

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Cobre

99.9 %

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Oxígeno

0.04 %

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Plomo

5E-3 %

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