EN 1652 Grade CuNi25 H070

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Description

CuNi25 is comparable to CuNi25, mat. no. 2.0830, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. CuNi25 is corrosion and wear resistant. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: Preferred alloy for coins due to its silver-white color, brilliance, tarnish resistance and favorable wear resistance. Further application as cladding material.

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValue

Densidad

20.0 °C

8.9 g/cm³

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Mecánica

PropertyTemperatureValue

Dureza Vickers

20.0 °C

70 - 100 [-]

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Módulo elástico

20.0 °C

145 GPa

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Aplicaciones térmicas

PropertyTemperatureValueComment

Calor específico

23.0 °C

375 - 398 J/(kg·K)

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Typical for Wrought Copper Nickel Grade

Coeficiente de dilatación térmica

300.0 °C

1.55E-5 1/K

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Conductividad térmica

20.0 °C

29 W/(m·K)

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Temperatura de fusión

915 - 1240 °C

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Typical for Wrought Copper Nickel Grade

Chemical properties

PropertyValue

Azufre

0.05 %

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Carbono

0.05 %

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Cobalto

0.1 %

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Estaño

0.03 %

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Hierro

0.3 %

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Manganeso

0.5 %

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Níquel

24 - 26 %

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Plomo

0.02 %

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Zinc

0.5 %

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