EN 12168 Grade CuTeP H080

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Description

CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

Property	Temperature	Value
Densidad	20.0 °C	8.9 g/cm³ Show Material materials with Densidad of 8.9 g/cm³

Mecánica

Property	Temperature	Value	Comment
Coeficiente de Poisson	23.0 °C	0.34 [-] Show Material materials with Coeficiente de Poisson of 0.34 [-]	Typical for Wrought Copper Pure / Low Alloyed Copper
Dureza Brinell	20.0 °C	80 - 130 [-] Show Material materials with Dureza Brinell of 80 - 130 [-]
Dureza Vickers	20.0 °C	90 - 140 [-] Show Material materials with Dureza Vickers of 90 - 140 [-]
Límite elástico Rp 0,2	20.0 °C	200 MPa Show Material materials with Límite elástico Rp 0,2 of 200 MPa
Módulo de cizallamiento	23.0 °C	48 GPa Show Material materials with Módulo de cizallamiento of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper
Módulo elástico	20.0 °C	120 GPa Show Material materials with Módulo elástico of 120 GPa
Resistencia a la tracción	20.0 °C	250 MPa Show Material materials with Resistencia a la tracción of 250 MPa

Aplicaciones térmicas

Property	Temperature	Value	Comment
Calor específico	23.0 °C	377 - 420 J/(kg·K) Show Material materials with Calor específico of 377 - 420 J/(kg·K)	Typical for Wrought Copper Pure / Low Alloyed Copper
Coeficiente de dilatación térmica	300.0 °C	1.8E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.8E-5 1/K
Conductividad térmica	20.0 °C	368 W/(m·K) Show Material materials with Conductividad térmica of 368 W/(m·K)
Temperatura de fusión		965 - 1100 °C Show Material materials with Temperatura de fusión of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper

Eléctrico

Property	Temperature	Value
Conductividad eléctrica	20.0 °C	5.00E+7 - 5.45E+7 S/m Show Material materials with Conductividad eléctrica of 5.00E+7 - 5.45E+7 S/m
Specific Electrical conductivity		86 % IACS Show Material materials with Specific Electrical conductivity of 86 % IACS

Chemical properties

Property	Value
Fósforo	0 - 0.01 % Show Material materials with Fósforo of 0 - 0.01 %
Telurio	0.4 - 0.7 % Show Material materials with Telurio of 0.4 - 0.7 %

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