LNP™ THERMOTUF™ Compound WF009N

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Description

LNP THERMOTUF WF009N is a PBT based compound containing 45% glass fiber for nano-molding technology (NMT) application especially at low molding temperature. Added features include high metal bonding strength.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.7 g/cm³

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ASTM D 792

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

2.1 %

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ISO 527 | break, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

144 J/m

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ASTM D 256 | notched, -30°C

Impact strength, Izod unnotched, ASTM

23.0 °C

1050 J/m

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ASTM D 4812 | 23°C

Módulo de flexión

23.0 °C

12.3 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

14.1 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

259 MPa

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ISO 178 | break, 2 mm/min

Resistencia a la tracción

23.0 °C

163 MPa

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ISO 527 | break, 5 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

17 kJ/m²

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ISO 179/2C | 23°C

Resistencia al choque, ensayo Charpy no entallado

23.0 °C

72 kJ/m²

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ISO 179/2C | 23°C

Resistencia al choque, ensayo Izod entallado

23.0 °C

16 kJ/m²

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ISO 180/1A | notched 80*10*4, -30°C

Resistencia al choque, ensayo Izod no entallado

23.0 °C

64 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

1.5E-5 1/K

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ASTM E 831 | -40°C to 40°C

Coeficiente de dilatación térmica transversal

23.0 °C

5.6E-5 1/K

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ASTM E 831 | -40°C to 40°C

Heat deflection temperature, 1.80 MPa

211 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

75 °C

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UL 746B

Relative temperature index, mechanical impact

75 °C

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UL 746B

Relative temperature index, mechanical strength

75 °C

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UL 746B

Temperatura de flexión bajo carga

211 °C

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Temperatura de reblandecimiento Vicat

213 °C

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ISO 306 | Rate A/50

Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103351811- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.7mm UL 94

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica

23.0 °C

3.95 [-]

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SABIC method | 1.9 GHz

Dielectric constant, 1GHz

23.0 °C

3.94 [-]

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SABIC method | 1.1 GHz

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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SABIC method |

Factor de disipación

23.0 °C

0.01 [-]

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SABIC method

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.14 %

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SABIC method

Contracción transversal

23.0 °C

0.34 %

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SABIC method

Velocidad de flujo del volumen derretido

29 cm³/10min

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ISO 1133 | MVR at 275°C/5 kg

Technological properties

Property
Application areas

Electrical Components & Infrastructure

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 100 to 120.0°C
Drying Time: 4 to 8.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 265 to 285.0°C
Nozzle Temperature: 265 to 285.0°C
Front - Zone 3 Temperature: 265 to 285.0°C
Middle - Zone 2 Temperature: 260 to 280.0°C
Rear - Zone 1 Temperature: 250 to 270.0°C
Mold Temperature: 100 to 140.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.