LNP™ THERMOCOMP™ Compound WF006XXP

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Description

LNP* THERMOCOMP* WF006XXP is a compound based on PBT resin containing 30% glass. Added features of this grade include: excellent strength, stiffness and dimensional stability, high heat resistance. Good for appliance handles, spotlights, electric motors, connectors.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

0.06 %

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ASTM D 570 | (23°C/24hrs)

Densidad

23.0 °C

1.53 g/cm³

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ASTM D 792

Densidad relativa

23.0 °C

1.53 [-]

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ASTM D 792 |

Moisture absorption

23.0 °C

0.08 %

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ISO 62 | (23°C / 50% RH)

Specific volume

23.0 °C

0.65 cm³/g

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ASTM D 792

Índice límite de óxigeno

23.0 °C

19 %

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Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

2 %

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ISO 527 | break, 5 mm/min

Hardness, Ball Indentation

23.0 °C

122 MPa

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ISO 2039-1 | H358/30

Hardness, Rockwell R

23.0 °C

118 [-]

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ISO 2039-2

Impact strength, Izod notched, ASTM

23.0 °C

85 J/m

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ASTM D 256

Impact strength, Izod unnotched, ASTM

23.0 °C

801 J/m

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ASTM D 4812 | 23°C

Instrumented Impact, Total Energy

23.0 °C

8 J

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ASTM D 3763 | 23°C

Módulo de flexión

23.0 °C

8.5 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

9.3 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

195 MPa

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ISO 178 | yield, 2 mm/min

Resistencia a la tracción

23.0 °C

125 MPa

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ISO 527 | break, 5 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

5 kJ/m²

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ISO 179/1eA | V-notch Edgew 80*10*4 sp=62mm, -30°C

Resistencia al choque, ensayo Charpy no entallado

23.0 °C

45 kJ/m²

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ISO 179/1eU | Unnotch Edgew 80*10*4 sp=62mm, -30°C

Resistencia al choque, ensayo Izod entallado

23.0 °C

7 kJ/m²

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ISO 180/1A | notched 80*10*4, -30°C

Resistencia al choque, ensayo Izod no entallado

23.0 °C

45 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Taber Abrasion

23.0 °C

19 mg/1000cy

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ASTM D 1044 | CS-17, 1 kg

Aplicaciones térmicas

PropertyTemperatureValueComment

Ball Pressure Test

Passs

IEC 60695-10-2 | 125°C +/- 2°C

Coeficiente de dilatación térmica

23.0 °C

2.52E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coeficiente de dilatación térmica transversal

23.0 °C

1.2E-4 1/K

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ISO 11359-2 | -40°C to 40°C

Conductividad térmica

23.0 °C

0.19 W/(m·K)

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ISO 8302

Glow Wire Flammability Index

800 °C

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Glow Wire Ignition Temperature

825 °C

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IEC 60695-2-13 | 3.0 mm

Heat deflection temperature, 0.45 MPa

217 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

204 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

140 °C

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UL 746B

Relative temperature index, mechanical impact

140 °C

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UL 746B

Relative temperature index, mechanical strength

140 °C

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UL 746B

Temperatura de flexión bajo carga

204 - 217 °C

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Temperatura de reblandecimiento Vicat

223 °C

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ISO 306 | Rate A/50

Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103952715- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.84mm UL 94 <br> Glow Wire Ignitability Temperature, 1.0 mm: 775°C IEC 60695-2-13 <br> Glow Wire Ignitability Temperature, 1.5 mm: 775°C IEC 60695-2-13 <br> Glow Wire Flammability Index, 1.0 mm: 750°C IEC 60695-2-12 <br> Glow Wire Flammability Index, 1.5 mm: 750°C IEC 60695-2-12 <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=103938351- -

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

3.1 [-]

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IEC 60250

Constante dieléctrica, 100 Hz

23.0 °C

3.8 [-]

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ASTM D 150

Dielectric constant, 60Hz

23.0 °C

3.1 [-]

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IEC 60250 | 50/60 Hz

Dissipation factor, 100Hz

23.0 °C

1E-3 [-]

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IEC 60250

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 60250

Dissipation factor, 50Hz

23.0 °C

1E-3 [-]

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IEC 60250 | 50/60 Hz

High Amp Arc Ignition

23.0 °C

0.38 mm

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≥, UL 746A | PLC 2

High Volt Arc Track Rate

23.0 °C

1 PLC Code

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UL 746A | (PLC)

Hot-Wire Ignition

23.0 °C

1.5 mm

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≥, UL 746A | PLC 1

Rigidez dieléctrica

23.0 °C

16 kV/mm

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IEC 60243-1 | in oil, 3.2 mm,

Sheet resistivity, ROA

23.0 °C

1.00E+15 Ω

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IEC 60093

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 60093

Índice de seguimiento comparativo

23.0 °C

0 V

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UL 746A | (UL) {PLC}

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.3 %

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SABIC method | on tensile bar

Contracción transversal

23.0 °C

0.5 %

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SABIC method | on tensile bar

Velocidad de flujo de la masa derretida

17 g/10min

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ISO 1133 | 250°C/2.16 kg

Velocidad de flujo del volumen derretido

13 cm³/10min

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ISO 1133 | MVR at 250°C/2.16 kg

Technological properties

Property
Application areas

Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 12hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 250 to 265.0°C
Nozzle Temperature: 245 to 260.0°C
Front - Zone 3 Temperature: 250 to 265.0°C
Middle - Zone 2 Temperature: 245 to 260.0°C
Rear - Zone 1 Temperature: 240 to 255.0°C
Mold Temperature: 65 to 90.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 50 to 80.0rpm
Shot to Cylinder Size: 40 to 80.0%
Vent Depth: 0.025 to 0.038mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.