AuGe12

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Description

Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuGe12 is u. a. as a mechanically highly durable, corrosion-resistant solder material for hermetically sealing ceramic IC packages and for connecting housing parts made of Cu and FeCoNi alloys at temperatures in the range of 400 to 500°C.

Related Standards

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValue

Densidad

20.0 °C

14.7 g/cm³

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Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.42 [-]

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Typical for Gold

Elongación

20.0 °C

1 %

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Límite elástico

20.0 °C

150 - 200 MPa

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Módulo de cizallamiento

23.0 °C

26 GPa

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Typical for Gold

Módulo elástico

20.0 °C

69.3 GPa

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Aplicaciones térmicas

PropertyTemperatureValueComment

Calor específico

23.0 °C

126 - 138 J/(kg·K)

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Typical for Gold

Coeficiente de dilatación térmica

23.0 °C

1.4E-5 1/K

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Typical for Gold

Conductividad térmica

20.0 °C

44.4 W/(m·K)

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Temperatura de fusión

1064 °C

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Typical for Gold

Eléctrico

PropertyTemperatureValue

Conductividad eléctrica

20.0 °C

7.00E+6 S/m

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Resistividad eléctrica

20.0 °C

1.4E-7 Ω·m

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Chemical properties

PropertyValue

Germanio

12 %

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Oro

88 %

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