PermaSOL™ 33-3

Alternative and trade names
High performance polymer
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A high temperature thermoset solution with low dielectric constant, high chemical resistance, high adhesion to various substrates, room temperature adhesion, no material movement and thermally curable.

This material data has been provided by Brewer Science.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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23.0 °C

1.0167 g/cm³

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Exact value: 1.01666



Elastic modulus

23.0 °C

3.4 GPa

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Coefficient of thermal expansion

23.0 °C

4.5E-5 1/K

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Glass transition temperature

100 °C

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Max service temperature

300 °C

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decomposition temperature



Dielectric constant

23.0 °C

2.7 [-]

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Dielectric constant, 10GHz

23.0 °C

2.7 [-]

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Technological properties

Application areas

High temperature adhesives and bonding. High temperature dielectric