Rubalit® IS 95

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Description

Rubalit® IS95 is a highly dense technical oxide ceramic material that can be determined by characteristics of hardness and high strength in combination with that of temperature stability. High corrosion against and wear resistance defines the material for excellent usage in various chemical applications.

Diese Materialdaten wurden von CeramTec zur Verfügung gestellt

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Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

Ashby charts

Eigenschaften

Allgemein

PropertyValueTesting StandardComment

Relative Dichte

3.7 [-]

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Archimedes

min.

Mechanisch

PropertyValueTesting StandardComment

Biegefestigkeit

330 MPa

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EN DIN 843-1

min. | 4-point bending 20/40 mm | spacing 46x4x3 mm specimen size | ground surface 20°C

Elastizitätsmodul

310 GPa

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EN DIN 843-2

Ultrasonic

Hardness, Vickers, 0.5

1100 [-]

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EN DIN 843-4

Härte, Vickers, 10

1050 [-]

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EN DIN 843-4

Poissonzahl

0.22 - 0.24 [-]

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EN DIN 843-2

Weibull-Modul

15 [-]

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4P

min.

Technological properties

Property
Application areas

Heat sink application


CeramCool® heat-sinks are an effective combination of circuit board and heat-sink for the reliable cooling of thermally sensitive components and circuits. They enable the direct and permanent connection of components and are excellently suited for thermal management and cooling of high-power LEDs, photovoltaic systems or high-performance circuits in high-power electronics. In addition to minimizing thermal resistance, eliminating additional layers and thus thermal barriers also reduces the number of components and potential sources of error in the overall system. This has a positive impact on the assembly process and ultimately on system cost. So the general rule for innovative thermal management with ceramic heat-sinks is: “Keep it simple” – a simplified system structure optimizes cooling. The ceramic materials used are Rubalit® aluminum oxide and Alunit® aluminum nitride, which can feature a number of different metalizations and conductor path structures – if necessary, even three-dimensional and “around the edge”. With its chip-on-heatsink technique, CeramTec has developed a process that also enables optimal thermal coupling to the cooling medium.