Zytel® HTN54G15HSLR NC010

Alternative und Handelsbezeichungen
PA-I-GF15
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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN54G15HSLR NC010 is a 15% glass reinforced, toughened, heat stabilized high performance polyamide resin. It is also a PPA resin.

Equivalent Materials

Diese Materialdaten wurden von Matmatch zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.25 g/cm³

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ISO 1183

Mechanisch

PropertyTemperatureValueComment

Biegemodul

23.0 °C

4.9 GPa

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ISO 178

Dehnung

23.0 °C

3.7 %

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ISO 527-1/-2

Elastizitätsmodul

23.0 °C

5.5 GPa

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ISO 527-1/-2

Poissonzahl

23.0 °C

0.35 [-]

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Schlagfestigkeit, Charpy gekerbt

23.0 °C

6 kJ/m²

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ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt

23.0 °C

70 kJ/m²

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ISO 179/1eU

Zugfestigkeit

23.0 °C

130 MPa

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ISO 527-1/-2

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 0.45 MPa

280 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

235 °C

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ISO 75-1/-2

Koeffizient der thermischen Ausdehnung

23.0 °C

3.2E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Schmelzpunkt

300 °C

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ISO 11357-1/-3 | first heat

thermischer Ausdehnungskoeffizient, transversal

23.0 °C

7E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Entflammbarkeit

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.8 mm, UL recognition: yes -, Oxygen index: 23 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Elektrisch

PropertyTemperatureValueComment

Dielektrizitätskonstante, 1 MHz

23.0 °C

3.9 [-]

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IEC 62631-2-1

Dielektrizitätskonstante, 100 Hz

23.0 °C

4.2 [-]

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IEC 62631-2-1

Dissipation factor, 100Hz

23.0 °C

5.5E-3 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Durchschlagfestigkeit

23.0 °C

16.5 kV/mm

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IEC 60243-1

Kriechstromfestigkeit

23.0 °C

575 V

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IEC 60112

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.4 %

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ISO 294-4, 2577

Schrumpfung, diagonal

23.0 °C

0.7 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

15% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C