EN 12164 Grade CuSP M

View suppliers (3)
Want to keep this datasheet? Save it now in your required format

Description

CuSP, mat. No CW114C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuSP, mat. No 2.1498, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. Already low S-contents increase the temperature for removal of workhardening to approx. 300°C. CuSP shows roughly the same electrical and thermal conductivity as pure copper. The corrosion resistance is equal to unalloyed copper. Processing properties: hot forming: moderately cold forming: good machinability: very good soft soldering: good hard soldering: moderately gas shielded welding: unfavorable burnishing: good Application: For screw machine parts and clamps in electronics, for nozzle, welding and cutting torches as well as for engine parts, valves and fittings.

Related Standards

Equivalent Materials

Diese Materialdaten wurden von WIAM zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Eigenschaften

Allgemein

PropertyTemperatureValue

Dichte

20.0 °C

8.9 g/cm³

Show Material materials with Dichte of 8.9 g/cm³

Mechanisch

PropertyTemperatureValueComment

Elastizitätsmodul

20.0 °C

120 GPa

Show Material materials with Elastizitätsmodul of 120 GPa

Poissonzahl

23.0 °C

0.34 [-]

Show Material materials with Poissonzahl of 0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Schubmodule

23.0 °C

48 GPa

Show Material materials with Schubmodule of 48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermisch

PropertyTemperatureValueComment

Koeffizient der thermischen Ausdehnung

100.0 °C

1.69E-5 1/K

Show Material materials with Koeffizient der thermischen Ausdehnung of 1.69E-5 1/K

200.0 °C

1.73E-5 1/K

Show Material materials with Koeffizient der thermischen Ausdehnung of 1.73E-5 1/K

300.0 °C

1.76E-5 1/K

Show Material materials with Koeffizient der thermischen Ausdehnung of 1.76E-5 1/K

Schmelzpunkt

965 - 1100 °C

Show Material materials with Schmelzpunkt of 965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Spezifische Wärmekapazität

20.0 °C

385 J/(kg·K)

Show Material materials with Spezifische Wärmekapazität of 385 J/(kg·K)

100.0 °C

394 J/(kg·K)

Show Material materials with Spezifische Wärmekapazität of 394 J/(kg·K)

200.0 °C

406 J/(kg·K)

Show Material materials with Spezifische Wärmekapazität of 406 J/(kg·K)

Unlock all property charts

Wärmeleitfähigkeit

20.0 °C

374 W/(m·K)

Show Material materials with Wärmeleitfähigkeit of 374 W/(m·K)

Chemical properties

PropertyValue

Phosphor

0 - 0.01 %

Show Material materials with Phosphor of 0 - 0.01 %

Schwefel

0.2 - 0.7 %

Show Material materials with Schwefel of 0.2 - 0.7 %

Looking for suppliers of this material? Click to see 3 supplier of EN 12164 Grade CuSP M on Matmatch