EN 12168 Grade CuTeP H080

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Description

CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

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Equivalent Materials

Diese Materialdaten wurden von WIAM zur Verfügung gestellt

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Eigenschaften

Allgemein

Property	Temperature	Value
Dichte	20.0 °C	8.9 g/cm³ Show Material materials with Dichte of 8.9 g/cm³

Mechanisch

Property	Temperature	Value	Comment
Elastizitätsmodul	20.0 °C	120 GPa Show Material materials with Elastizitätsmodul of 120 GPa
Härte, Brinell	20.0 °C	80 - 130 [-] Show Material materials with Härte, Brinell of 80 - 130 [-]
Härte, Vickers	20.0 °C	90 - 140 [-] Show Material materials with Härte, Vickers of 90 - 140 [-]
Poissonzahl	23.0 °C	0.34 [-] Show Material materials with Poissonzahl of 0.34 [-]	Typical for Wrought Copper Pure / Low Alloyed Copper
Schubmodule	23.0 °C	48 GPa Show Material materials with Schubmodule of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper
Streckgrenze Rp 0,2	20.0 °C	200 MPa Show Material materials with Streckgrenze Rp 0,2 of 200 MPa
Zugfestigkeit	20.0 °C	250 MPa Show Material materials with Zugfestigkeit of 250 MPa

Thermisch

Property	Temperature	Value	Comment
Koeffizient der thermischen Ausdehnung	300.0 °C	1.8E-5 1/K Show Material materials with Koeffizient der thermischen Ausdehnung of 1.8E-5 1/K
Schmelzpunkt		965 - 1100 °C Show Material materials with Schmelzpunkt of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper
Spezifische Wärmekapazität	23.0 °C	377 - 420 J/(kg·K) Show Material materials with Spezifische Wärmekapazität of 377 - 420 J/(kg·K)	Typical for Wrought Copper Pure / Low Alloyed Copper
Wärmeleitfähigkeit	20.0 °C	368 W/(m·K) Show Material materials with Wärmeleitfähigkeit of 368 W/(m·K)

Elektrisch

Property	Temperature	Value
Elektrische Leitfähigkeit	20.0 °C	5.00E+7 - 5.45E+7 S/m Show Material materials with Elektrische Leitfähigkeit of 5.00E+7 - 5.45E+7 S/m
Specific Electrical conductivity		86 % IACS Show Material materials with Specific Electrical conductivity of 86 % IACS

Chemical properties

Property	Value
Phosphor	0 - 0.01 % Show Material materials with Phosphor of 0 - 0.01 %
Tellur	0.4 - 0.7 % Show Material materials with Tellur of 0.4 - 0.7 %

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