LNP™ THERMOCOMP™ Compound OF008

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Description

LNP THERMOCOMP OF008 is a compound based on PPS - Linear resin containing 40% Glass Fiber.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Coefficient of friction

0.41 - 0.5 [-]

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Coefficient of friction, kinetic

0.41 [-]

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ASTM D 3702 Modified: Manual

Coefficient of friction, static

0.5 [-]

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ASTM D 3702 Modified: Manual

Dichte

23.0 °C

1.7 g/cm³

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ASTM D 792

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

233 MPa

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ISO 178 | break, 2 mm/min

Biegemodul

23.0 °C

12.9 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

1.4 %

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ISO 527 | break, 5 mm/min

Elastizitätsmodul

23.0 °C

14.4 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

96 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

534 J/m

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ASTM D 4812 | 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

10 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Schlagzähigkeit, Izod ungekerbt

23.0 °C

50 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Zugfestigkeit

23.0 °C

159 MPa

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ISO 527 | break, 5 mm/min

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 0.45 MPa

278 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

252 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

1.4E-5 1/K

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ISO 11359-2 | 23°C to 60°C

Relative temperature index, electrical

220 °C

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UL 746B

Relative temperature index, mechanical impact

200 °C

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UL 746B

Relative temperature index, mechanical strength

220 °C

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UL 746B

Wärmeformbeständigkeitstemperatur

252 - 278 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

4.5E-5 1/K

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ISO 11359-2 | 23°C to 60°C

Entflammbarkeit

UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=101283821- - <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101284690- - <br> UL Recognized, 94-5VA Flame Class Rating: ≥3mm UL 94 <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.45mm UL 94 <br> UL Yellow Card Link 3: https://iq.ul.com/ul/cert.aspx?ULID=101344459- - <br> UL Yellow Card Link 4: https://iq.ul.com/ul/cert.aspx?ULID=101344627- -

Elektrisch

PropertyTemperatureValueComment

High Amp Arc Ignition

23.0 °C

1.5 mm

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≥, UL 746A | PLC 4

High Volt Arc Track Rate

23.0 °C

1 PLC Code

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UL 746A | (PLC)

Hot-Wire Ignition

23.0 °C

1.5 mm

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≥, UL 746A | PLC 2

Kriechstromfestigkeit

23.0 °C

4 V

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UL 746A | (UL) {PLC}

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.3 %

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ASTM D 955 | 24 hrs

Schrumpfung, diagonal

23.0 °C

1 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Enclosure/Housing/Cover, Wiring Devices, Medical Device

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120 to 150.0°C
Drying Time: 4hrs
Melt Temperature: 315 to 320.0°C
Front - Zone 3 Temperature: 330 to 345.0°C
Middle - Zone 2 Temperature: 320 to 330.0°C
Rear - Zone 1 Temperature: 305 to 315.0°C
Mold Temperature: 140 to 165.0°C
Back Pressure: 0.2 to 0.3MPa
Screw Speed: 30 to 60.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.