NORYL™ Resin HM3020H - Asia

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Description

NORYL™ HM3020H resin is a 30% glass and mineral filled blend of polyphenylene ether (PPE) + high impact polystyrene (HIPS). This high flow, injection moldable grade contains non-brominated, non-chlorinated flame retardant and carries a UL94 flame ratings of 5VB and V1. NORYL HM3020H resin exhibits good dimensional stabily, Low warpage, and low moisture absorption. It is an excellent candidate for printer chassis and components.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

Ashby charts

Eigenschaften

Allgemein

PropertyTemperatureValueComment

Relative Dichte

23.0 °C

1.33 [-]

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ASTM D 792

Wasserabsorption

23.0 °C

0.06 %

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ASTM D 570 | (23°C/24hrs)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

147 MPa

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ASTM D 790

Biegemodul

23.0 °C

7.9 GPa

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ASTM D 790

Dehnung

23.0 °C

4 - 6 %

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SABIC - Japan Method | break

Härte, Rockwell M

23.0 °C

88 [-]

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ASTM D 785 |

Impact strength, Izod notched, ASTM

23.0 °C

58 J/m

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ASTM D 256 | notched, 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

58 kJ/m²

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ASTM D 256 | notched, 23°C

Zugfestigkeit

23.0 °C

115 MPa

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SABIC - Japan Method | yield

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 1.80 MPa

125 °C

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ASTM D 648 | 6.4 mm, unannealed

Koeffizient der thermischen Ausdehnung

23.0 °C

2.4E-5 - 3.4E-5 1/K

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TMA | -30°C to 30°C

Wärmeformbeständigkeitstemperatur

125 °C

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Elektrisch

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+16 Ω

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Schmelzmassenflussrate

17.7 g/10min

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ASTM D 1238 | 300°C/2.16 kgf

Schrumpfung

23.0 °C

0.25 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Electronic Components, Enclosures, ATM/Ticket Machine, Data Transfer, Document Handling, Personal Computing, Small Appliance

Availability

Asia

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.