LNP™ THERMOCOMP™ Compound DX14354X

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Description

LNP Thermocomp compound DX14354X is an improved flow, colorable compound based on PC copolymer resin developed for applications that require Laser Direct Structuring (LDS) for antenna, or electronic circuit manufacturing. Thermocomp compound DX14354X helps customers to improve productivity with stable plating and RF performance, excellent impact strength and surface finish.

Diese Materialdaten wurden von Sabic zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.29 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.05 %

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ISO 62 | (23°C / 50% RH)

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

86 MPa

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ISO 178 | yield, 2 mm/min

Biegemodul

23.0 °C

2.6 GPa

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ISO 178 | 2 mm/min

Dehnung

23.0 °C

5 %

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ISO 527 | yield, 50 mm/min

Elastizitätsmodul

23.0 °C

2.5 GPa

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ISO 527 | 1 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

750 J/m

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ASTM D 256 | notched, 23°C

Schlagzähigkeit, Izod gekerbt

23.0 °C

60 kJ/m²

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ISO 180/1A | 80*10*3, 23°C

Zugfestigkeit

23.0 °C

47 MPa

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ISO 527 | break, 50 mm/min

Thermisch

PropertyTemperatureValueComment

Heat deflection temperature, 1.80 MPa

113 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Koeffizient der thermischen Ausdehnung

23.0 °C

5.7E-5 1/K

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ASTM E 831 | -40°C to 40°C

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Vicat-Erweichungstemperatur

128 °C

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ASTM D 1525 | Rate A/50

Wärmeformbeständigkeitstemperatur

113 °C

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thermischer Ausdehnungskoeffizient, transversal

23.0 °C

6E-5 1/K

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ASTM E 831 | -40°C to 40°C

Entflammbarkeit

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102180157- - <br> UL Recognized, 94V-1 Flame Class Rating: ≥1mm UL 94

Elektrisch

PropertyTemperatureValueComment

Dielectric constant, 1GHz

23.0 °C

3.06 [-]

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SABIC method | 1.1 GHz

Dielectric constant, 5GHz

23.0 °C

3.08 [-]

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SABIC method

Dielektrizitätskonstante

23.0 °C

3.08 [-]

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SABIC method | 1.9 GHz

Dissipation factor, 1GHz

23.0 °C

6.3E-3 [-]

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SABIC method |

Dissipation factor, 5GHz

23.0 °C

5.9E-3 [-]

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SABIC method

Sheet resistivity, ROA

23.0 °C

1.20E+16 Ω

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ASTM D 257

Verlustfaktor

23.0 °C

6.1E-3 [-]

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SABIC method

Volume resistivity

23.0 °C

1.20E+16 Ω·cm

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Schmelzvolumenflussrate

25 cm³/10min

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ISO 1133 | MVR at 260°C/5.0 kg

Schrumpfung

23.0 °C

0.5 %

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ASTM D 955 | 24 hrs

Schrumpfung, diagonal

23.0 °C

0.5 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Wireless Communications, Wearables, Personal Computing, Enclosures, Antenna

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 110 to 120.0°C
Drying Time: 2 to 4.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 250 to 270.0°C
Nozzle Temperature: 240 to 260.0°C
Front - Zone 3 Temperature: 245 to 265.0°C
Middle - Zone 2 Temperature: 240 to 255.0°C
Rear - Zone 1 Temperature: 230 to 245.0°C
Hopper Temperature: 40 to 60.0°C
Mold Temperature: 40 to 100.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.