Eigenschaften
Allgemein
| Property | Temperature | Value | Comment |
|---|---|---|---|
Dichte | 23.0 °C | 1.04 g/cm³ Show Supplier Material materials with Dichte of 1.04 g/cm³ | ASTM D792 |
Wasserabsorption | 23.0 °C | 0.07 % Show Supplier Material materials with Wasserabsorption of 0.07 % | ASTM D570 |
Mechanisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Biegemodul | 23.0 °C | 2.26 GPa Show Supplier Material materials with Biegemodul of 2.26 GPa | ASTM D790 |
Dehnung | 23.0 °C | 45 % Show Supplier Material materials with Dehnung of 45 % | ASTM D638 |
Hardness, Rockwell R | 23.0 °C | 99 [-] Show Supplier Material materials with Hardness, Rockwell R of 99 [-] | ASTM D785 |
Schlagzähigkeit, Izod ungekerbt | 23.0 °C | 11.5 kJ/m² Show Supplier Material materials with Schlagzähigkeit, Izod ungekerbt of 11.5 kJ/m² | ISO 180 |
Streckgrenze | 23.0 °C | 45 MPa Show Supplier Material materials with Streckgrenze of 45 MPa | ASTM D638 |
Thermisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Heat deflection temperature, 1.80 MPa | 80 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 80 °C | ASTM D648 | |
Koeffizient der thermischen Ausdehnung | 23.0 °C | 9.05E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 9.05E-5 1/K | ASTM D696 |
Vicat-Erweichungstemperatur | 80 °C Show Supplier Material materials with Vicat-Erweichungstemperatur of 80 °C | ASTM D1525 |
Elektrisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Durchschlagfestigkeit | 23.0 °C | 150 kV/mm Show Supplier Material materials with Durchschlagfestigkeit of 150 kV/mm | ASTM D149 |
Surface resistivity | 23.0 °C | 1.00E+13 Ω/sq Show Supplier Material materials with Surface resistivity of 1.00E+13 Ω/sq | IEC 93 |
Rheological Properties
| Property | Value | Comment |
|---|---|---|
Schmelzmassenflussrate | 3 g/10min Show Supplier Material materials with Schmelzmassenflussrate of 3 g/10min | ASTM D1238 |
Technological properties
| Property | ||
|---|---|---|
| Application areas | SHEET FOR THERMOFORMING, FOOD PACKAGING, ELECTRONIC PACKAGING | |