General
Property | Value | Testing Standard | Condition |
---|---|---|---|
Absorción de agua | 1.8 % Show Supplier Material materials with Absorción de agua of 1.8 % | Sim. to ISO 62 | |
Densidad | 1.02 g/cm³ Show Supplier Material materials with Densidad of 1.02 g/cm³ | ISO 1183 | dry |
Moisture absorption | 0.7 % Show Supplier Material materials with Moisture absorption of 0.7 % | Sim. to ISO 62 | |
Índice límite de óxigeno | 22 % Show Supplier Material materials with Índice límite de óxigeno of 22 % | ISO 4589-1/-2 | dry |
Mecánica
Property | Temperature | Value | Condition | Testing Standard | Comment |
---|---|---|---|---|---|
Elongación | 50 % Show Supplier Material materials with Elongación of 50 % | cond., dry | ISO 527-1/-2 | min. | nominal | |
Elongation at yield | 7 % Show Supplier Material materials with Elongation at yield of 7 % | cond., dry | ISO 527-1/-2 | ||
Límite elástico | 42 MPa Show Supplier Material materials with Límite elástico of 42 MPa | cond. | ISO 527-1/-2 | ||
Módulo elástico | 1.2 GPa Show Supplier Material materials with Módulo elástico of 1.2 GPa | cond. | ISO 527-1/-2 | ||
1.4 GPa Show Supplier Material materials with Módulo elástico of 1.4 GPa | dry | ISO 527-1/-2 | |||
Resistencia al choque, ensayo Charpy entallado | -30 °C | 5 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Charpy entallado of 5 kJ/m² | cond. | ISO 179/1eA | |
23 °C | 9 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Charpy entallado of 9 kJ/m² | cond. | ISO 179/1eA | ||
Resistencia al choque, ensayo Charpy no entallado | No Break at 23 and -30°C | cond. | ISO 179/1eU |
Aplicaciones térmicas
Property | Value | Condition | Testing Standard | Comment | |||
---|---|---|---|---|---|---|---|
Coeficiente de dilatación térmica | 0.00013 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 0.00013 1/K | dry | ISO 11359-1/-2 | ||||
Temperatura de fusión | 178 °C Show Supplier Material materials with Temperatura de fusión of 178 °C | dry | ISO 11357-1/-3 | 10°C/min | |||
Temperatura de reblandecimiento Vicat | 142 °C Show Supplier Material materials with Temperatura de reblandecimiento Vicat of 142 °C | ISO 306 | 50°C/h 50N | ||||
Inflamabilidad | At thickness 1.5 mm IEC 60695-11-10: HB, At thickness 3.2 mm IEC 60695-11-10: V-2 and yellow card available |
Eléctrico
Property | Value | Condition | Frequency | Testing Standard |
---|---|---|---|---|
Constante dieléctrica | 3 [-] Show Supplier Material materials with Constante dieléctrica of 3 [-] | dry | 1MHz | IEC 60250 |
4 [-] Show Supplier Material materials with Constante dieléctrica of 4 [-] | dry | 100Hz | IEC 60250 | |
Factor de disipación | 0.029 [-] Show Supplier Material materials with Factor de disipación of 0.029 [-] | dry | 1MHz | IEC 60250 |
0.0779 [-] Show Supplier Material materials with Factor de disipación of 0.0779 [-] | dry | 100Hz | IEC 60250 | |
Rigidez dieléctrica | 30 kV/mm Show Supplier Material materials with Rigidez dieléctrica of 30 kV/mm | cond. | IEC 60243-1 | |
Surface resistivity | 1e+14 Ω/sq Show Supplier Material materials with Surface resistivity of 1e+14 Ω/sq | cond. | IEC 60093 | |
Volume resistivity | 1e+12 Ω·cm Show Supplier Material materials with Volume resistivity of 1e+12 Ω·cm | cond. | IEC 60093 | |
Índice de seguimiento comparativo | 600 V Show Supplier Material materials with Índice de seguimiento comparativo of 600 V | cond. | IEC 60112 |
Rheological Properties
Property | Value | Condition | Testing Standard | Comment |
---|---|---|---|---|
Contracción | 0.8 % Show Supplier Material materials with Contracción of 0.8 % | dry | ISO 294-4 | |
0.8 % Show Supplier Material materials with Contracción of 0.8 % | dry | ISO 294-4 | Transverse | |
Velocidad de flujo del volumen derretido | 57 cm³/10min Show Supplier Material materials with Velocidad de flujo del volumen derretido of 57 cm³/10min | dry | ISO 1133 | 235°C/2.16kg |
Technological properties
Property | ||
---|---|---|
Application areas | Connectors,Monofilaments,Tubing and Hoses | |
Certifications | Yellow Card | |
Processing methods | Injection Molding: |