EN 12164 Grade CuSP M

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Description

CuSP, mat. No CW114C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuSP, mat. No 2.1498, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. Already low S-contents increase the temperature for removal of workhardening to approx. 300°C. CuSP shows roughly the same electrical and thermal conductivity as pure copper. The corrosion resistance is equal to unalloyed copper. Processing properties: hot forming: moderately cold forming: good machinability: very good soft soldering: good hard soldering: moderately gas shielded welding: unfavorable burnishing: good Application: For screw machine parts and clamps in electronics, for nozzle, welding and cutting torches as well as for engine parts, valves and fittings.

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

Property	Temperature	Value
Densidad	20.0 °C	8.9 g/cm³ Show Material materials with Densidad of 8.9 g/cm³

Mecánica

Property	Temperature	Value	Comment
Coeficiente de Poisson	23.0 °C	0.34 [-] Show Material materials with Coeficiente de Poisson of 0.34 [-]	Typical for Wrought Copper Pure / Low Alloyed Copper
Módulo de cizallamiento	23.0 °C	48 GPa Show Material materials with Módulo de cizallamiento of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper
Módulo elástico	20.0 °C	120 GPa Show Material materials with Módulo elástico of 120 GPa

Aplicaciones térmicas

Property	Temperature	Value	Comment
Calor específico	20.0 °C	385 J/(kg·K) Show Material materials with Calor específico of 385 J/(kg·K)
	100.0 °C	394 J/(kg·K) Show Material materials with Calor específico of 394 J/(kg·K)
	200.0 °C	406 J/(kg·K) Show Material materials with Calor específico of 406 J/(kg·K)

Coeficiente de dilatación térmica	100.0 °C	1.69E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.69E-5 1/K
	200.0 °C	1.73E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.73E-5 1/K
	300.0 °C	1.76E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.76E-5 1/K
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Conductividad térmica	20.0 °C	374 W/(m·K) Show Material materials with Conductividad térmica of 374 W/(m·K)
Temperatura de fusión		965 - 1100 °C Show Material materials with Temperatura de fusión of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper

Chemical properties

Property	Value
Azufre	0.2 - 0.7 % Show Material materials with Azufre of 0.2 - 0.7 %
Fósforo	0 - 0.01 % Show Material materials with Fósforo of 0 - 0.01 %

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