EN 1977 Grade Cu-HCP H040

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Description

Cu-DHP, mat. No CW021A, is a deoxidized copper with low phosphorus-content. To the comparable DIN-mark SF-Cu, mat. No 2.0070 acc. to DIN 1787: 1973-01 (precondition for the comparability: Cu-content min. 99,95%, deoxidation agent phosphorus) applies: The material is also available in a special quality free of steam stripping elements. This is very important for vacuum technology. Tensile strength and Brinell hardness are increasable by cold forming. SE-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: good Application: Preferably application in electrical engineering, electronics. For production of all types of semifinished parts when high electrical conductivity is demanded as well as in vacuum technology and as cladding material.

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

Property	Temperature	Value
Densidad	20.0 °C	8.9 - 8.94 g/cm³ Show Material materials with Densidad of 8.9 - 8.94 g/cm³

Mecánica

Property	Temperature	Value	Comment
Coeficiente de Poisson	20.0 °C	0.34 [-] Show Material materials with Coeficiente de Poisson of 0.34 [-]
Dureza Brinell	20.0 °C	40 [-] Show Material materials with Dureza Brinell of 40 [-]
Dureza Vickers	20.0 °C	40 - 65 [-] Show Material materials with Dureza Vickers of 40 - 65 [-]
Límite elástico Rp 0,2	20.0 °C	50 MPa Show Material materials with Límite elástico Rp 0,2 of 50 MPa
Módulo de cizallamiento	23.0 °C	48 GPa Show Material materials with Módulo de cizallamiento of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper
Módulo elástico	20.0 °C	127 - 129 GPa Show Material materials with Módulo elástico of 127 - 129 GPa
Resistencia a la tracción	20.0 °C	200 MPa Show Material materials with Resistencia a la tracción of 200 MPa

Aplicaciones térmicas

Property	Temperature	Value	Comment
Calor específico	20.0 °C	385 - 390 J/(kg·K) Show Material materials with Calor específico of 385 - 390 J/(kg·K)
	100.0 °C	393 J/(kg·K) Show Material materials with Calor específico of 393 J/(kg·K)
	200.0 °C	403 J/(kg·K) Show Material materials with Calor específico of 403 J/(kg·K)

Coeficiente de dilatación térmica	100.0 °C	1.69E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.69E-5 1/K
	200.0 °C	1.73E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.73E-5 1/K
	300.0 °C	1.76E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.76E-5 1/K
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Conductividad térmica	20.0 °C	385 - 386 W/(m·K) Show Material materials with Conductividad térmica of 385 - 386 W/(m·K)
Temperatura de fusión		965 - 1100 °C Show Material materials with Temperatura de fusión of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper

Eléctrico

Property	Temperature	Value
Conductividad eléctrica	20.0 °C	5.70E+7 S/m Show Material materials with Conductividad eléctrica of 5.70E+7 S/m
Resistividad eléctrica	20.0 °C	1.8E-8 Ω·m Show Material materials with Resistividad eléctrica of 1.8E-8 Ω·m
Specific Electrical conductivity		98 % IACS Show Material materials with Specific Electrical conductivity of 98 % IACS

Chemical properties

Property	Value
Bismuto	5E-4 % Show Material materials with Bismuto of 5E-4 %
Cobre	99.95 % Show Material materials with Cobre of 99.95 %
Fósforo	2E-3 - 7E-3 % Show Material materials with Fósforo of 2E-3 - 7E-3 %
Plomo	5E-3 % Show Material materials with Plomo of 5E-3 %

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EN 1977 Grade Cu-HCP H040

Description

Related Standards

Equivalent Materials

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Propiedades