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Hot Pressed Boron Nitride

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Description

Hot pressed Boron Nitride is manufactured by hot pressing. Its crystal structure is hexagonal. Due to the uniaxial densification method, the anisotropy of its platelet structure is created. As a result of the anisotropy, different physical properties occur, parallel or perpendicular to the pressing direction. It is a non-toxic material and can be easily machined.

Ashby charts

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Properties

General

Density

ρ

1.9 - 1.95 g/cm³ at 20 °C

Thermal

Coefficient of thermal expansion

α

6.7E-7 1/K at 700 °C

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Coefficient of thermal expansion, transverse

αtrans

8.7E-7 1/K at 1500 °C

Max service temperature

Tmax

850 °C

Max service temperature, inert

Tmax,inert

1150 °C

Thermal conductivity

λ

27.22 W/(m·K) at 20 °C

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Thermal conductivity, transverse

λtrans

30.98 W/(m·K) at 20 °C

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Electrical

Dielectric strength

EDS

39.4 kV/mm at 20 °C

Electrical resistivity

ρel

1.70E+12 Ω·m at 20 °C

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Electrical resistivity, transverse

ρel,trans

4.00E+12 Ω·m at 20 °C

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Chemical properties

Element

Weight %

Comment

N

49 - 52.9 %

B

40 - 42.6 %

O

3 - 5 %

Ca

0.5 - 3 %

Other

0.4 %

Boric Oxides

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Technological properties

Application areas

Electrical insulators for high power transistors and thyristors; Electrical insulators and vacuum feedthroughs in high temperature furnaces; Thermocouple protection tubes; Crucibles and rollers for molten glass and metals; Rolls and support elements in the glass manufacturing industries

Other

The key features are: Excellent thermal behaviour; High electrical resistivity; Chemically Stable; Extraordinary thermocycling properties; High temperature material

Processing history

Hot pressing

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This material data has been provided by Goodfellow.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.