Propiedades
General
| Property | Temperature | Value | |
|---|---|---|---|
Densidad | 23.0 °C | 2 g/cm³ Show Supplier Material materials with Densidad of 2 g/cm³ | |
Aglutinante | B₂O₃ | ||
Mecánica
Aplicaciones térmicas
| Property | Temperature | Value |
|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 1.8E-6 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 1.8E-6 1/K |
Conductividad térmica | 23.0 °C | 40 W/(m·K) Show Supplier Material materials with Conductividad térmica of 40 W/(m·K) |
Eléctrico
| Property | Temperature | Value |
|---|---|---|
Resistividad eléctrica | 23.0 °C | 1.00E+16 Ω·m Show Supplier Material materials with Resistividad eléctrica of 1.00E+16 Ω·m |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes. | |
| Processing methods | Hot Pressed Sintering, Chemical Vapor Deposition | |