Zytel® 153HSL NC010

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Description

DuPont™ Zytel® LCPA long chain polyamide resins provide an innovative and growing portfolio of flexible polymers with excellent thermal, chemical, and hydrolysis resistance. The diverse selection of Zytel® LCPA grades is targeted for a range of performance characteristics, balancing temperature resistance, flexibility and low permeation. Zytel® 153HSL NC010 is a heat stabilized, lubricated polyamide 612 resin for molding and extrusion.

Equivalent Materials

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

3 %

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Sim. to ISO 62 | 80mil

Densidad

23.0 °C

1.06 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.38 [-]

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Elongación

23.0 °C

30 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

4.4 %

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ISO 527-1/-2

Hardness, Ball Indentation

23.0 °C

170 MPa

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ISO 2039-1

Límite elástico

23.0 °C

62 MPa

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ISO 527-1/-2

Módulo de flexión

23.0 °C

2.1 GPa

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ISO 178

Módulo elástico

23.0 °C

2.4 GPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

-6.0 °C

5 kJ/m²

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ISO 179/1eA

23.0 °C

4 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Izod no entallado

-30.0 °C

5 kJ/m²

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ISO 180/1A

23.0 °C

4 kJ/m²

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ISO 180/1A

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Resistencia al cizallamiento

23.0 °C

60 MPa

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ASTM D 732

Resistencia al choque, ensayo Charpy no entallado

No Break @ 23,-6°C, ISO 179/1eA

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

1.7E-4 1/K

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ISO 11359-1/-2 | 23 - 55°C

Coeficiente de dilatación térmica transversal

23.0 °C

1.8E-4 1/K

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ISO 11359-1/-2 | 55 - 160°C

Difusividad térmica

23.0 °C

0 mm²/s

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Heat deflection temperature, 0.45 MPa

135 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

62 °C

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ISO 75-1/-2

Relative temperature index, electrical

105 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

65 °C

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UL 746B | 120mil

Temperatura de fusión

218 °C

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ISO 11357-1/-3 | 18°F/min

Temperatura de reblandecimiento Vicat

180 °C

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ISO 306 | 90°F/h, 11 lbf

Inflamabilidad

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.86 mm, UL recognition: yes -, Oxygen index: 27 %, Glow Wire Flammability Index, 30mil: 825 °C, Glow Wire Flammability Index, 60mil: 775 °C, Glow Wire Flammability Index, 120mil: 925 °C, Glow Wire Ignition Temperature, 30mil: 700 °C, Glow Wire Ignition Temperature, 60mil: 700 °C, Glow Wire Ignition Temperature, 120mil: 700 °C, Glow Wire Temperature, No Flame, 40mil: 700 °C, Glow Wire Temperature, No Flame, 120mil: 750 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

3.2 [-]

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IEC 62631-2-1

Constante dieléctrica, 100 Hz

23.0 °C

3.6 [-]

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IEC 62631-2-1

Dissipation factor, 100Hz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Rigidez dieléctrica

23.0 °C

22.6 kV/mm

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IEC 60243-1 | Short Time, 2mm

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Índice de seguimiento comparativo

23.0 °C

600 V

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IEC 60112

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

1.3 %

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ISO 294-4, 2577

Contracción transversal

23.0 °C

1.4 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 80°C, Drying Time, Dehumidified Dryer: 2-4h, Processing Moisture Content: ≤0.15%, Melt Temperature Optimum: 250°C, Min. melt temperature: 230°C, Max. melt temperature: 290°C, Mold Temperature Optimum: 70°C, Min. mold temperature: 50°C, Max. mold temperature: 90°C