Zytel® HTN55G55TLW BK117

Nombres alternativos y comerciales
PA-I-GF55
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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN55G55TLW BK117 is a 55% glass reinforced high performance polyamide resinwith improved toughness and low warpage, developed for structural applications where good flow is needed in thin sections. It is also a PPA resin.

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.66 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.33 [-]

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Elongación

23.0 °C

1.8 %

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ISO 527-1/-2

Módulo de flexión

23.0 °C

17 GPa

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ISO 178

Módulo elástico

23.0 °C

18.7 GPa

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ISO 527-1/-2

Resistencia a la flexión

23.0 °C

360 MPa

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ISO 178

Resistencia a la tracción

23.0 °C

243 MPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

-40.0 °C

20 kJ/m²

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ISO 179/1eA

23.0 °C

18 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Charpy no entallado

23.0 °C

75 kJ/m²

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ISO 179/1eU

Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 1.80 MPa

236 °C

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ISO 75-1/-2

Temperatura de fusión

296 °C

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ISO 11357-1/-3 | first heat

Inflamabilidad

Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Glow Wire Flammability Index, 30mil: 725 °C, Glow Wire Flammability Index, 60mil: 725 °C, Glow Wire Flammability Index, 120mil: 960 °C, Glow Wire Ignition Temperature, 30mil: 750 °C, Glow Wire Ignition Temperature, 60mil: 750 °C, Glow Wire Ignition Temperature, 120mil: 850 °C

Eléctrico

PropertyTemperatureValueComment

Índice de seguimiento comparativo

23.0 °C

600 V

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IEC 60112

Technological properties

Property
Fillers

55% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Min. melt temperature: 300°C, Max. melt temperature: 315°C, Min. mold temperature: 70°C, Max. mold temperature: 130°C