Zytel® HTNFR52G45BL BK337

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFR52G45BL BK337 is a 45% glass reinforced, flame retardant, lubricated high performance polyamide resin that has been developed for connector applications.

Equivalent Materials

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.76 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.33 [-]

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Elongación

23.0 °C

1.3 %

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ISO 527-1/-2

Módulo de flexión

23.0 °C

15.2 GPa

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ISO 178

Módulo elástico

23.0 °C

17 GPa

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ISO 527-1/-2

Resistencia a la flexión

23.0 °C

290 MPa

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ISO 178

Resistencia a la tracción

23.0 °C

175 MPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

-40.0 °C

13 kJ/m²

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ISO 179/1eA

23.0 °C

13 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Charpy no entallado

-6.0 °C

40 kJ/m²

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ISO 179/1eU

23.0 °C

42 kJ/m²

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ISO 179/1eU

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Resistencia al choque, ensayo Izod no entallado

23.0 °C

12 kJ/m²

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ISO 180/1A

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

8E-6 1/K

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ISO 11359-1/-2 | 23 - 55°C

Coeficiente de dilatación térmica transversal

23.0 °C

7.5E-5 1/K

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ISO 11359-1/-2 | 55 - 160°C

Heat deflection temperature, 0.45 MPa

300 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

284 °C

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ISO 75-1/-2

Relative temperature index, electrical

140 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

120 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

130 °C

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UL 746B | 120mil

Temperatura de fusión

310 °C

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ISO 11357-1/-3 | first heat

Inflamabilidad

Burning Behav. at 60mil nom. thickn.: V-0 class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: V-0 class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 49 %, Glow Wire Flammability Index, 40mil: 960 °C, Glow Wire Ignition Temperature, 40mil: 900 °C, Glow Wire Temperature, No Flame, 40mil: 875 °C, Glow Wire Temperature, No Flame, 60mil: 875 °C, Glow Wire Temperature, No Flame, 80mil: 875 °C, Glow Wire Temperature, No Flame, 120mil: 875 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

3.6 [-]

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IEC 62631-2-1

Constante dieléctrica, 100 Hz

23.0 °C

3.9 [-]

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IEC 62631-2-1

Dissipation factor, 100Hz

23.0 °C

4.5E-3 [-]

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IEC 62631-2-1

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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ASTM D 2520 B

Dissipation factor, 1MHz

23.0 °C

0.01 [-]

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IEC 62631-2-1

Rigidez dieléctrica

23.0 °C

31 kV/mm

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IEC 60243-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Índice de seguimiento comparativo

23.0 °C

500 V

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IEC 60112

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.2 %

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ISO 294-4, 2577

Contracción transversal

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

45% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C