Zytel® HTNFR55G50NHLW BK046

Nombres alternativos y comerciales
PA-GF50FR(40)
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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFR55G50NHLW BK046 is a 50% glass reinforced, flame retardant high performance polyamide resin with improved flow and low warpage in structural applications requiring good surface appearance. It is also a PPA resin and uses a non-halogenated flame retardant.

Equivalent Materials

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.65 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.33 [-]

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Elongación

23.0 °C

1.6 %

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ISO 527-1/-2

Módulo de flexión

23.0 °C

17 GPa

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ISO 178

Módulo elástico

23.0 °C

18 GPa

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ISO 527-1/-2

Resistencia a la flexión

23.0 °C

310 MPa

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ISO 178

Resistencia a la tracción

23.0 °C

200 MPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

23.0 °C

13 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Charpy no entallado

23.0 °C

50 kJ/m²

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ISO 179/1eU

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

1.3E-5 1/K

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ISO 11359-1/-2

Coeficiente de dilatación térmica transversal

23.0 °C

3.8E-5 1/K

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ISO 11359-1/-2

Heat deflection temperature, 1.80 MPa

215 °C

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ISO 75-1/-2

Relative temperature index, electrical

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

65 °C

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UL 746B | 120mil

Temperatura de fusión

298 °C

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ISO 11357-1/-3 | first heat

Inflamabilidad

Burning Behav. at 60mil nom. thickn.: V-0 class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: V-0 class, Thickness tested: 0.4 mm, UL recognition: yes -, FMVSS Class: DNI -

Eléctrico

PropertyTemperatureValueComment

Dielectric constant, 10GHz

23.0 °C

4.4 [-]

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ASTM D 2520 B

Dielectric constant, 1GHz

23.0 °C

4.3 [-]

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ASTM D 2520 B

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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ASTM D 2520 B

Índice de seguimiento comparativo

23.0 °C

600 V

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IEC 60112

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.1 %

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ISO 294-4, 2577

Contracción transversal

23.0 °C

0.2 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

50% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Min. melt temperature: 300°C, Max. melt temperature: 315°C, Min. mold temperature: 70°C, Max. mold temperature: 130°C