Zytel® HTNFE8200 BK431

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTNFE8200 BK431 is an unreinforced, toughened, heat stabilized high performance polyamide resin for injection molding. It is also a PPA resin.

Equivalent Materials

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.13 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.39 [-]

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Elongación

23.0 °C

14 %

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ISO 527-1/-2

Elongation at yield

23.0 °C

5.5 %

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ISO 527-1/-2

Límite elástico

23.0 °C

69 MPa

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ISO 527-1/-2

Módulo de flexión

23.0 °C

2.1 GPa

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ISO 178

Módulo elástico

23.0 °C

2.2 GPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

23.0 °C

80 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Charpy no entallado

No Break @ 23,-6°C, ISO 179/1eA

Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 0.45 MPa

138 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

125 °C

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ISO 75-1/-2

Temperatura de fusión

300 °C

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ISO 11357-1/-3 | first heat

Inflamabilidad

FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Eléctrico

PropertyTemperatureValueComment

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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min. | IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

1 %

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ISO 294-4, 2577

Contracción transversal

23.0 °C

1 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Min. mold temperature: 80°C, Max. mold temperature: 120°C