Zytel® HTN51G15HSL BK083

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Description

Zytel® HTN51G15HSL BK083 is a 15% glass reinforced, heat stabilized, lubricated, hydrolysis resistant high performance polyamide resin. It is also a PPA resin.

Equivalent Materials

Los datos sobre este material han sido proporcionados por Matmatch.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.3 g/cm³

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ISO 1183

Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.35 [-]

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Elongación

23.0 °C

2 %

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ISO 527-1/-2

Módulo de flexión

23.0 °C

5.8 GPa

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ISO 178

Módulo elástico

23.0 °C

6.5 GPa

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ISO 527-1/-2

Resistencia a la tracción

23.0 °C

110 MPa

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ISO 527-1/-2

Resistencia al choque, ensayo Charpy entallado

-40.0 °C

5 kJ/m²

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ISO 179/1eA

23.0 °C

5 kJ/m²

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ISO 179/1eA

Resistencia al choque, ensayo Charpy no entallado

23.0 °C

23 kJ/m²

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ISO 179/1eU

Resistencia al choque, ensayo Izod no entallado

-40.0 °C

5 kJ/m²

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ISO 180/1A

23.0 °C

5 kJ/m²

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ISO 180/1A

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Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 0.45 MPa

276 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

250 °C

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ISO 75-1/-2

Relative temperature index, electrical

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

130 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

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UL 746B | 120mil

Temperatura de fusión

300 °C

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ISO 11357-1/-3 | first heat

Temperatura de transición del vidrio

135 °C

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ISO 11357-1/-2 | 18°F/min

Inflamabilidad

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 23 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

3.7 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Índice de seguimiento comparativo

23.0 °C

575 V

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IEC 60112

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.3 %

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ISO 294-4, 2577

Contracción transversal

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C