General
Property | Temperature | Value | Comment |
---|---|---|---|
Absorción de agua | 23.0 °C | 1.1 % Show Material materials with Absorción de agua of 1.1 % | Sim. to ISO 62 | Immersion 24h |
Densidad | 23.0 °C | 1.09 g/cm³ Show Material materials with Densidad of 1.09 g/cm³ | ISO 1183 |
Mecánica
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coeficiente de Poisson | 23.0 °C | 0.41 [-] Show Material materials with Coeficiente de Poisson of 0.41 [-] | |||
Elongación | 23.0 °C | 75 % Show Material materials with Elongación of 75 % | ISO 527-1/-2 | 50mm/min | ||
Elongation at yield | 23.0 °C | 30 % Show Material materials with Elongation at yield of 30 % | ISO 527-1/-2 | ||
Límite elástico | 23.0 °C | 47 MPa Show Material materials with Límite elástico of 47 MPa | ISO 527-1/-2 | ||
Módulo de flexión | 23.0 °C | 1.8 GPa Show Material materials with Módulo de flexión of 1.8 GPa | ISO 178 | ||
Módulo elástico | 23.0 °C | 1.9 GPa Show Material materials with Módulo elástico of 1.9 GPa | ISO 527-1/-2 | ||
Resistencia a la tracción | 23.0 °C | 45 MPa Show Material materials with Resistencia a la tracción of 45 MPa | ISO 527-1/-2 | 50mm/min | ||
Resistencia al choque, ensayo Charpy entallado | -40.0 °C | 19 kJ/m² Show Material materials with Resistencia al choque, ensayo Charpy entallado of 19 kJ/m² | ISO 179/1eA | ||
23.0 °C | 80 kJ/m² Show Material materials with Resistencia al choque, ensayo Charpy entallado of 80 kJ/m² | ISO 179/1eA | |||
Resistencia al choque, ensayo Izod no entallado | -40.0 °C | 18 kJ/m² Show Material materials with Resistencia al choque, ensayo Izod no entallado of 18 kJ/m² | ISO 180/1A | ||
23.0 °C | 80 kJ/m² Show Material materials with Resistencia al choque, ensayo Izod no entallado of 80 kJ/m² | ISO 180/1A | |||
Resistencia al choque, ensayo Charpy no entallado | No Break @ 23°C, ISO 179/1eU | ||||
Resistencia al choque, ensayo Izod entallado | No Break @ 23°C, ISO 179/1eU |
Aplicaciones térmicas
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 1.5E-4 1/K Show Material materials with Coeficiente de dilatación térmica of 1.5E-4 1/K | ISO 11359-1/-2 | ||
Coeficiente de dilatación térmica transversal | 23.0 °C | 1.3E-4 1/K Show Material materials with Coeficiente de dilatación térmica transversal of 1.3E-4 1/K | ISO 11359-1/-2 | ||
Heat deflection temperature, 0.45 MPa | 162 °C Show Material materials with Heat deflection temperature, 0.45 MPa of 162 °C | ISO 75-1/-2 | |||
Heat deflection temperature, 1.80 MPa | 62 °C Show Material materials with Heat deflection temperature, 1.80 MPa of 62 °C | ISO 75-1/-2 | |||
Relative temperature index, electrical | 125 °C Show Material materials with Relative temperature index, electrical of 125 °C | UL 746B | 120mil | |||
Relative temperature index, mechanical impact | 75 °C Show Material materials with Relative temperature index, mechanical impact of 75 °C | UL 746B | 120mil | |||
Relative temperature index, mechanical strength | 85 °C Show Material materials with Relative temperature index, mechanical strength of 85 °C | UL 746B | 120mil | |||
Temperatura de fusión | 262 °C Show Material materials with Temperatura de fusión of 262 °C | ISO 11357-1/-3 | 18°F/min | |||
Inflamabilidad | Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, FMVSS Class: B -, Burning rate, Thickness 1 mm: 26 mm/min |
Eléctrico
Property | Temperature | Value | Comment |
---|---|---|---|
Constante dieléctrica, 1 MHz | 23.0 °C | 3.7 [-] Show Material materials with Constante dieléctrica, 1 MHz of 3.7 [-] | IEC 62631-2-1 |
Constante dieléctrica, 100 Hz | 23.0 °C | 3.9 [-] Show Material materials with Constante dieléctrica, 100 Hz of 3.9 [-] | IEC 62631-2-1 |
Dissipation factor, 100Hz | 23.0 °C | 6E-3 [-] Show Material materials with Dissipation factor, 100Hz of 6E-3 [-] | IEC 62631-2-1 |
Dissipation factor, 1MHz | 23.0 °C | 0.01 [-] Show Material materials with Dissipation factor, 1MHz of 0.01 [-] | IEC 62631-2-1 |
Rigidez dieléctrica | 23.0 °C | 25 kV/mm Show Material materials with Rigidez dieléctrica of 25 kV/mm | IEC 60243-1 |
Volume resistivity | 23.0 °C | 1.00E+15 Ω·cm Show Material materials with Volume resistivity of 1.00E+15 Ω·cm | min. | IEC 62631-3-1 |
Índice de seguimiento comparativo | 23.0 °C | 600 V Show Material materials with Índice de seguimiento comparativo of 600 V | IEC 60112 |
Rheological Properties
Technological properties
Property | ||
---|---|---|
Processing methods | Drying Recommended: yes, Drying Temperature: 80°C, Drying Time, Dehumidified Dryer: 2-4h, Processing Moisture Content: ≤0.2%, Melt Temperature Optimum: 290°C, Min. melt temperature: 280°C, Max. melt temperature: 300°C, Max. screw tangential speed: 0.3m/s, Mold Temperature Optimum: 80°C, Min. mold temperature: 50°C, Max. mold temperature: 100°C, Hold pressure range: 50-100MPa, Hold pressure time: 4s/mm, Ejection temperature: 190°C |